1. 10 layer board.
2. FR4 Tg170 material.
3. blind via resin hole + plating filled,Buried via,Pads over via.
4. Control system usage.
5. 0.078mm line track and space.
1 | Layers | 10L |
2 | Material | FR4 Tg170 |
3 | Board thick | 1.58mm |
4 | App | Control system |
5 | Min hole | 0.1mm |
6 | Min line copper | 0.078mm |
7 | Min gap | 0.078mm |
8 | Surface finish | Immersion gold 2u'' |
9 | Cu thickness | 1OZ |
10 | Solder resist | Blue LPI |
11 | Blind via | Have |
12 | Buried via | Have |
13 | Pads over via | Have |
14 | Certs | UL,ISO16949,RoHS compliant,ISO9001/14001,SGS |
FAQ
Q1:HDI means?
A: High density Interconnect.
Q2:HDI summary?
A: PCB with a higher wiring density per unit area than conventional board,They have finer line and space<=0.1mm,smaller via(<=0.15mm) and capture pad<=0.4mm, and higher connection paddensity(>20pads/cm2) than conventional board.
Q3:What about quality assurance?
A: As for HDI board,We must ensure 100% test ok then delivery.
Q4: What about leadtime?
A: Normally 20 working days production time for HDI boards.
Q5: Where's your clients?
A: America,Europe,India,Southeast Asia etc.
Plant overview: