1. 8 layers hdi board.
2. FR4 substrate.
3. PTH wall 25um.
4. 4OZ heavy copper.
5. Blind/Buried via and VIP process.
1 | Layer | 8 |
2 | Substrate | FR4 |
3 | PCB thickness | 1.63mm |
4 | PTH wall | 25um |
5 | Laser hole | 0.1mm |
6 | Min line width | 0.076mm |
7 | Min spacing | 0.076mm |
8 | Surface treatment | ENIG 3u'' |
9 | Copper weight | 4OZ |
10 | Solder mask | 25um |
11 | Blind hole | Yes |
12 | Buried hole | Yes |
13 | VIP process | Yes |
14 | Certificate | UL,ISO16949,ISO9001/14001,SGS,RoHS |
FAQ
Q1:HDI definition?
A: High density Interconnect.
Q2:Which type holes in the HDI board?
A: Blind via resin plug,buried via,VIP hole, etc.
Q3:How many lamination you can make?
A: As for HDI board,We can make 3times lamination.
Q4: How about PTH wall?
A: Normally 20um average.
Q5:How about the delivery time?
A: 4 weeks for HDI board.
Factory overview: