LPI 35um rigid flex circuits PCB Mainboard FR4 Polyimide Flex PCB Board
Item | Spec |
Layers | 1~20 |
Board Thickness | 0.1mm-8.0mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size | 600mm×1200mm |
Min Hole Size | 0.1mm |
Min Line Width/Space | 3mil(0.075mm) |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 0.10mm--6.30mm |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 16:01 |
Solder Mask Type | LPI |
SMT Mini. Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance Control Tolerance | 士10% |
Surface finish | ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask | Green/Yellow/Black/White/Red/Blue |
Silkscreen | Red/Yellow/Black/White |
Certificate | UL, ISO 9001, ISO14001, IATF16949 |
Special Request | Blind hole, Gold finger, BGA, Carbon ink, peelable mask, VIP process, Edge plating, Half holes |
Material Suppliers | Shengyi, ITEQ, Taiyo, etc. |
Common Package | Vacuum+Carton |
Lead Time
Category | Q/T Lead time | Standard Lead Time | Mass Production | |||
2 Layers | 24hrs | 3-4 working days | 8-15 working days | |||
4 Layers | 48hrs | 3-5 working days | 10-15 working days | |||
6 Layers | 72hrs | 3-6 working days | 10-15 working days | |||
8 Layers | 96hrs | 3-7 working days | 14-18 working days | |||
10 Layers | 120hrs | 3-8 working days | 14-18 working days | |||
12 Layers | 120hrs | 3-9 working days | 20-26 working days | |||
14 Layers | 144hrs | 3-10 working days | 20-26 working days | |||
16-20 Layers | Depends on the specific requirements | |||||
20+ Layers | Depends on the specific requirements |