Ni/Au 3u'' 5u'' Printed Circuit Board, 3OZ Double Sided Circuit Board
PCBA Capacity
Capacity | |
Single and double-sided SMT/PTH | Yes |
Large parts on both sides, BGA on both sides | Yes |
Smallest Chips size | 0201 |
Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
Min Leaded parts pitch | 0.008 in. (0.2 mm) |
Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
Assembly surface mount connectors | Yes |
Odd form parts: | Yes, Assembly by hands |
LED | |
Resistor and capacitor networks | |
Electrolytic capacitors | |
Variable resistors and capacitors (pots) | |
Sockets | |
Reflow soldering | Yes |
Max PCB size | 14.5 in. x 19.5 in. |
Min PCB Thickness | 0.2 |
Fiducial Marks | Preferred but not required |
PCB Finish: | 1. SMOBC/HASL |
2. Electrolytic gold | |
3. Electroless gold | |
4. Electroless silver | |
5. Immersion gold | |
6. Immersion tin | |
7. OSP | |
PCB Shape | Any |
Panelized PCB | 1. Tab routed |
2. Breakaway tabs | |
3. V-Scored | |
4. Routed+ V scored | |
Inspection | 1. X-ray analysis |
2. Microscope to 20X | |
Rework | 1. BGA removal and replacement station |
2. SMT IR rework station | |
3. Thru-hole rework station | |
Firmware | Provide programming firmware files,Firmware + software installation instructions |
Function test | Level of testing required along with test instructions |
PCB file: | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |
PCB Capacity
Layers | 1~20 |
Board Thickness | 0.1mm-8.0mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size | 600mm×1200mm |
Min Hole Size | 0.1mm |
Min Line Width/Space | 3mil(0.075mm) |
Board Outline Tolerance | 0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 0.10mm--6.30mm |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 16:01 |
Solder Mask Type | LPI |
SMT Mini. Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance Control Tolerance | 10% |
Surface finish | ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask | Green/Yellow/Black/White/Red/Blue |
Silkscreen | Red/Yellow/Black/White |
Certificate | UL, ISO 9001, ISO14001, IATF16949 |
Special Request | Blind hole, Gold finger, BGA, Carbon ink, peelable mask, VIP process, Edge plating, Half holes |
Material Suppliers | Shengyi, ITEQ, Taiyo, etc. |
Common Package | Vacuum+Carton |
ABIS Circuits Co., Ltd established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters.
Category | Q/T Lead time | Standard Lead Time | Mass Production | |||
2 Layers | 24hrs | 3-4 working days | 8-15 working days | |||
4 Layers | 48hrs | 3-5 working days | 10-15 working days | |||
6 Layers | 72hrs | 3-6 working days | 10-15 working days | |||
8 Layers | 96hrs | 3-7 working days | 14-18 working days | |||
10 Layers | 120hrs | 3-8 working days | 14-18 working days | |||
12 Layers | 120hrs | 3-9 working days | 20-26 working days | |||
14 Layers | 144hrs | 3-10 working days | 20-26 working days | |||
16-20 Layers | Depends on the specific requirements | |||||
20+ Layers | Depends on the specific requirements |
Factory View
Packaging & Delivery
Rigid PCB, Flexible PCB, Rigid-Flex PCB, HDI PCB, PCB Assembly
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.
ABIS cares every your order even 1 piece