1.6mm FR4 TG135 TG150 TG170 Multilayer Printed Circuit Board with Peelable Mask
PCBA
Capacity | |
Single and double-sided SMT/PTH | Yes |
Large parts on both sides, BGA on both sides | Yes |
Smallest Chips size | 0201 |
Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
Min Leaded parts pitch | 0.008 in. (0.2 mm) |
Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
Assembly surface mount connectors | Yes |
Odd form parts: | Yes, Assembly by hands |
LED | |
Resistor and capacitor networks | |
Electrolytic capacitors | |
Variable resistors and capacitors (pots) | |
Sockets | |
Reflow soldering | Yes |
Max PCB size | 14.5 in. x 19.5 in. |
Min PCB Thickness | 0.2 |
Fiducial Marks | Preferred but not required |
PCB Finish: | 1. SMOBC/HASL |
2. Electrolytic gold | |
3. Electroless gold | |
4. Electroless silver | |
5. Immersion gold | |
6. Immersion tin | |
7.OSP | |
PCB Shape | Any |
Panelized PCB | 1. Tab routed |
2. Breakaway tabs | |
3. V-Scored | |
4. Routed+ V scored | |
Inspection | 1. X-ray analysis |
2. Microscope to 20X | |
Rework | 1. BGA removal and replacement station |
2. SMT IR rework station | |
3. Thru-hole rework station | |
Firmware | Provide programming firmware files,Firmware + software installation instructions |
Function test | Level of testing required along with test instructions |
PCB file: | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |
PCB
Layers | 1~20 |
Board Thickness | 0.1mm-8.0mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size | 600mm×1200mm |
Min Hole Size | 0.1mm |
Min Line Width/Space | 3mil(0.075mm) |
Board Outline Tolerance | 0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 0.10mm--6.30mm |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 16:01 |
Solder Mask Type | LPI |
SMT Mini. Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance Control Tolerance | 10% |
Surface finish | ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask | Green/Yellow/Black/White/Red/Blue |
Silkscreen | Red/Yellow/Black/White |
Certificate | UL, ISO 9001, ISO14001, IATF16949 |
Special Request | Blind hole, Gold finger, BGA, Carbon ink, peelable mask, VIP process, Edge plating, Half holes |
Material Suppliers | Shengyi, ITEQ, Taiyo, etc. |
Common Package | Vacuum+Carton |
ABIS Circuits Co., Ltd established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters.
Our products are mostly used in the field of Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, and others.
Now we have passed ISO9001, ISO14001, UL, etc., With constant hard work of our staff and ongoing support from customers both home and abroad, we can provide up to 20 layers, Blind and buried Board, high-precision(Rogers), High TG, Alu-base and flexible boards to our customer with fast turn and high-quality level.
Factory View
Packaging & Delivery
ABIS CIRCUITS Company is not only trying to give customers a good product, but also pay attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.
-Common packaging:
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.
ABIS cares every your order even 1 piece