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FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm
FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm
FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm
FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm
Specifications
Brand Name :
China chao sheng
Model Number :
16L third-order HDI
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
Negotiation
Payment Terms :
T/T, Western Union
Supply Ability :
5-200K/pcs per month
Delivery Time :
35day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification :
ISO/UL/RoHS/TS
Board thickness :
1.6mm
Copper thickness :
1oz
Base material :
FR-4
Min. line spacing :
0.075mm
Min. line width :
1/2 oz. copper .003" +/- .0005" (0.0762mm)
Min. hole size :
0.1mm-1mm
Surface finishing :
Gold plating
Number of layers :
2/4/6/8/10/12 Layers
Product name :
High quality fast proofing HDI 2-12 layer Printed circuit board pcb
Testing service :
Omron AOI/X-Ray/ICT/Solder Paste Testing/Function Testing
Solder mask color :
Green/white/yellow/black/blue/purple
Silkscreen color :
Green/white/yellow/black/blue/purple
Layer :
1-64 layers
Description

16L third-order HDI plate thickness 1.8mm,Shengyi FR-4+TG170, minimum hole 0.10mm,HDI Printed Circuit Boards,hdi pcb

Product Description

  1. Product area: automotive products
  2. Number of layers: 16L third-order HDI plate thickness 1.8mm ± 10%;
  3. Process structure: Shengyi FR-4+TG170, minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/3mil
  4. Surface treatment: electric gold 1u"
  5. Surface treatment: electric gold
  6. Quantities range from prototype to volume production.
  7. 100% E-Test
  8. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
  9. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Our capability

  1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
  2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
  3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
  4. ROHS compliant and lead-free process.
  5. In-circuit, functional tests& burn-in tests, full system test
  6. High output to guarantee prompt delivery.

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

Product tags

fr4 1.2mm double sided pcb

,

fr4 1.5mm double sided pcb

,

fr4 0.8mm double sided pcb
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FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm

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Product Detail
Brand Name :
China chao sheng
Model Number :
16L third-order HDI
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
Negotiation
Payment Terms :
T/T, Western Union
Contact Supplier
FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm
FR4 HDI Printed Circuit Boards Plate Thickness 1.8mm TG170 Minimum Hole 0.10mm

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PCB Board Service, PCB Assembly Services, PCB Prototype Service
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
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