10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed
Product Description
PCB, FPC process production capability
PCB capability and services:
PCB Assembly services:
Through-hole Assembly
PCB, FPC process production capability
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
Technicalltem | Mass Product | Advanced Technolgy | |||||
2017year | 2018year | 2019year | |||||
Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
Multi-layer overlay | N+N | N+N | N+N | ||||
N+X+N | N+X+N | N+X+N | |||||
sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole |
Certificate:
IPC Standard
ISO9001
ISO/TS16949
UL
Testing and value added services:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT, or using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.
3. By sea for mass quantity according to customer's requirement.
4. By customer's Forwarder
6. T/T, West Union, etc.
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.