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Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Specifications
Brand Name :
China chao sheng
Model Number :
10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
Negotiation
Payment Terms :
T/T, Western Union
Delivery Time :
30-35day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification :
ISO/UL/RoHS/TS
Supply Ability :
5-200K/pcs per month
Surface finishing :
Immersion Gold
Base material :
FR4
Min. line spacing :
0.075mm
Board thickness :
1.6mm
Min. line width :
0.075mm/0.1mm(3mil/4mil)
Copper thickness :
1oz
Min. hole size :
0.1mm
Product name :
HUA XING PCBA LIMITED
Material :
FR4/94v0/Aluminum/cem-1 cem-3/
Service :
PCB&PCBA
Application :
Consumer Electronics
Type :
PCB assembly
Layer :
1-24layers
Usage :
PCB assembly
Silkscreen :
white
Pcb standard :
IPC-A-610 D
Description

10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing,SMT PCB Service smt pcb assembly

Product Description

  1. 10-layer automotive product PCBA
  2. 10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
  3. Packing requirements: vacuum packaging, electrostatic film, plastic box (optional one,
  4. blister box packaging requires additional billing + carton packaging)
  5. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

One stop services

  1. PCB layout
  2. Electronic design
  3. Engineering
  4. PCB fabrication
  5. PCB Assembly
  6. Box Build
  7. IC Programming
  8. Testing
  9. Parts sourcing
  10. Supply management
  11. After sales servies et

PCB capability and services

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.

5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.

6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.

7. Quantities range from prototype to volume production.

8. 100% E-Test

PCB Assembly services

  1. SMT Assembly
  2. Automatic Pick & Place
  3. Component Placement as Small as 0201
  4. Fine Pitch QEP - BGA
  5. Automatic Optical Inspection

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing

IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)

Packing design

Certificate:

IPC Standard

ISO9001

ISO/TS16949

UL

Testing and value added services:

AOI (Automatic optical inspection)

ICT(In-circuit test)

Reliability test

X-Ray Test

Analogue and digital function test

Firmware programming

Shipping Method and Payment terms:

1. By DHL, UPS, FedEx, TNT, or using clients account.

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.

3. By sea for mass quantity according to customer's requirement.

4. By customer's Forwarder

6. T/T, West Union, etc.

Product tags

nickel plating thickness

,

2mm copper sheet

,

0.5mm copper sheet
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Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG

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Product Detail
Brand Name :
China chao sheng
Model Number :
10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
Negotiation
Payment Terms :
T/T, Western Union
Contact Supplier
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG
Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PCB Board Service, PCB Assembly Services, PCB Prototype Service
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
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