Rigid Flex Circuit Boards PCB Green Solder Mask FR4+Polyimide Material Thickness 1.6mm With Copper 1OZ Fast Delivery
Product Description
Detailed Specification of Flexible PCB Manufacturing
Technical Specification | ||
Layers: | 2~106(flex Pcb) and 2~10 (rigid flex) | |
Min Panel Size: | 5mm x 8mm | |
Max Panel Size: | 250 x 520mm | |
Min Finished board thickness: | 0.05mm (1 sided inclusive copper) | |
Max Finished board thickness: | 0.3mm (2 sided inclusive copper) | |
Finished board thickness tolerance: | ±0.02~0.03mm | |
Material: | Kapton, Polyimide, PET | |
Base copper thickness (RA or ED): | 1/3 oz, 1/2 oz, 1oz, 2oz | |
Base PI thickness: | 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil | |
Stiffner: | Polyimide, PET, FR4, SUS | |
Min Finished hole diameter: | Φ 0.15mm | |
Max Finished hole diameter: | Φ 6.30mm | |
Finished hole diameter tolerance (PTH): | ±2 mil ( ±0.050mm) | |
Finished hole diameter tolerance (NPTH): | ±1 mil ( ±0.025mm) | |
Min width/spacing (1/3oz): | 0.05mm/0.06mm | |
Min width/spacing (1/2oz): | 0.06mm/0.07mm | |
Min width/spacing (1oz): | Single layer: 0.07mm/0.08mm | |
Double layer: 0.08mm/0.09mm | ||
Aspect Ratio | 6:01 | 8:01 |
Base Copper | 1/3Oz--2Oz | 3 Oz for Prototype |
Size Tolerance | Conductor Width:±10% | W ≤0.5mm |
Hole Size: ±0.05mm | H ≤1.5mm | |
Hole Registration: ±0.050mm | ||
Outline Tolerance:±0.075mm | L ≤50mm | |
Surface Treatment | ENIG: 0.025um - 3um | |
OSP: | ||
Immersion Tin: 0.04-1.5um | ||
Dielectric Strength | AC500V | |
Solder Float | 288℃/10s | IPC Standard |
Peeling Strength | 1.0kgf/cm | IPC-TM-650 |
Flammability | 94V-O | UL94 |
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming :
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray:
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA