2L plate thickness: 2000mm*565mm; Large PCB Prototype Board rigid flex pcb manufacturers,Large PCB Prototype Board,double sid

Product Description

The PCBs are used for wide range of electronic products:

Such as Medical devices, Military equipment ,autos mobile ,CCTV, Power supply, GPS, UPS, Set-top Box, Telecommunication ,LED, etc.

2L plate thickness: 2000mm*565mm; Large PCB Prototype Board rigid flex pcb manufacturers,Large PCB Prototype Board rigid flex pcb manufacturers,Large PCB Prototype Board,double side

Product area: South Gate System LED

Number of layers: 2L plate thickness: 1.2mm;

Size: 2000mm*565mm/1PCS

Process structure: FR-4TG135, minimum hole 0.60mm, minimum line width 4/4mi, linear test, aperture ratio

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

1:1,Packing: true hole packaging + humidity card + moisture-proof beads / carton

One stop services

• PCB layout
• Electronic design
• Engineering
• PCB fabrication
• PCB Assembly
• Box Build
• IC Programming
• Testing
• Parts sourcing
• Supply management
• After sales servies et12

• Our Quality processes include:
  1. IQC: Incoming Quality Control (Incoming Materials Inspection)
  2. First Article Inspection for every process
  3. IPQC: In Process Quality Control
  4. QC: 100% Test & Inspection
  5. QA: Quality Assurance based on QC inspection again
  6. Workmanship: IPC-A-610, ESD
  7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

  Certificates:
  ISO9001-2008
  ISO/TS16949
  UL
  IPC-A-600G and IPC-A-610E Class II compliance
  Customer's requirements

  Quick Detail:

  1. PCB Assembly on SMT and DIP

  2. PCB schematic drawing/ layout /producing

  3. PCBA clone/change board

  4. Components sourcing and purchasing for PCBA

  5. Enclosure design and plastic injection molding

  6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

  7. IC programming

  PCB, FPC product application field
  Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

  FAQ:
  Q: What files do you use in PCB fabrication?
  A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
  Q: Is it possible you could offer sample?
  A: Yes, we can custom you sample to test before mass production
  Q: When will I get the quotation after sent Gerber, BOM and test procedure?
  A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
  Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
  A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
  Q: How can I make sure the quality of my PCB?
  A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

• PCB, FPC process production capability

  Technical ltem		MassProduct		Advanced Technology
  		2016		2017		2018
  Max.Layer Count		26L		36L		80L
  Through-hole plate		2～45L		2～60L		2～80L
  Max.PCBSize(in)		24*52"		25*62"		25*78.75"
  The layer number of FPC		1～36L		1～50L		1～60L
  Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
  Layeredplatelayer		2～12L		2～18L		2～26L
  Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
  Combination of hard and soft layers		3～26L		3～30L		3～50L
  Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
  HDI PCB		4～45L		4～60L		4～80L
  Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
  Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
  Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
  Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
  Build-up Material		FR-4		FR-4		FR-4
  BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
  	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
  	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
  	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
  	MAX(mm)	3.5		10.0mm		10.0mm
  Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
  Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
  BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
  	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
  Gold thick		1～40u"		1～60u"		1～120u"
  Nithick		76～127u"		76～200u"		1～250u"
  Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
  Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
  Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
  DieletricThickness		38(1.5)		32(1.3)		32(1.3)
  		125(5)		125(5)		125(5)
  SKipvia		Yes		Yes		Yes
  viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
  Laser Hole Filling		Yes		Yes		Yes
  Technicalltem				Mass Product		Advanced Technolgy
  				2017year		2018year	2019year
  Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
  Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
  Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
  Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
  		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
  BGAPitch mm(Mil)				0.3		0.3	0.3
  Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
  Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
  		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
  		≦3mil		±0.60		±0.60	±0.60
  Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
  		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
  		Multi-layer overlay		N+N		N+N	N+N
  				N+X+N		N+X+N	N+X+N
  		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
  		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
  PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

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