12-layer Anylayer structure, minimum hole 0.10mm, plate thickness 1.20mm, nickel palladium gold, green oil, metal edging + half hole + resin plug hole + plating filling

1. Product area: Automotive system products
2. Number of layers: 12 layers of order two HDI, FR-4, TG150, plate thickness 1.60mm, laser hole 0.1mm, hole in the plate, resin hole filling + copper filling copper,
3. Impedance tolerance: ±10%
4. Surface treatment: OSP + gold finger,
5. Test method: computer 100% E-Test
6. Packing: vacuum packaging + desiccant + humidity card + carton
7. Mode of transport: air, sea, motor, logistics, express

8. Product Type: Bluetooth Control Board

   Size: 78*52mm/1PCS

   12-layer Anylayer structure, minimum hole 0.10mm, plate thickness 1.60mm, nickel palladium gold, green oil, metal edging + half hole + resin plug hole + plating filling

9. Printed circuit board (pcb) and PCBA product areas
   Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
   Winding circuit board (fpc) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Our service

1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB)
2. PCBA contract manufacturing
3. Electronic contract manufacturing service
4. Through hole assembly/DIP assembly
5. Bonding assembly
6. Final assembly
7. Full Turnkey Box Build
8. Mechanical / electrical assembly
9. Supply Chain Management/Components procurement
10. PCB fabrication
11. Technical support

12. PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products:

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    Tag:

    pcb prototype assembly service,

    circuit board printing service

    PCB, FPC process production capability

    Technical ltem		MassProduct		Advanced Technology
    		2016		2017		2018
    Max.Layer Count		26L		36L		80L
    Through-hole plate		2～45L		2～60L		2～80L
    Max.PCBSize(in)		24*52"		25*62"		25*78.75"
    The layer number of FPC		1～36L		1～50L		1～60L
    Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
    Layeredplatelayer		2～12L		2～18L		2～26L
    Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
    Combination of hard and soft layers		3～26L		3～30L		3～50L
    Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
    HDI PCB		4～45L		4～60L		4～80L
    Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
    Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
    Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
    Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
    Build-up Material		FR-4		FR-4		FR-4
    BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
    	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
    	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
    	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
    	MAX(mm)	3.5		10.0mm		10.0mm
    Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
    Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
    BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
    	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
    Gold thick		1～40u"		1～60u"		1～120u"
    Nithick		76～127u"		76～200u"		1～250u"
    Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
    Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    DieletricThickness		38(1.5)		32(1.3)		32(1.3)
    		125(5)		125(5)		125(5)
    SKipvia		Yes		Yes		Yes
    viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
    Laser Hole Filling		Yes		Yes		Yes
    Technicalltem				Mass Product		Advanced Technolgy
    				2017year		2018year	2019year
    Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
    Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
    Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
    Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    BGAPitch mm(Mil)				0.3		0.3	0.3
    Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
    Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
    		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
    		≦3mil		±0.60		±0.60	±0.60
    Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
    		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
    		Multi-layer overlay		N+N		N+N	N+N
    				N+X+N		N+X+N	N+X+N
    		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole
    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray