8 layers 2order HDI plate PCB,FR-4+TG150,finger electric nickel gold 20U "+ sinking gold Gold Finger,minimum hole 0.35mm,HDI Printed Circuit Boards,rigid flex pcb manufacturers

Product Description

1. Product area: Intelligent system products
2. Number of layers: 8 layers 2order HDI plate thickness 0.50mm;
3. Process structure: FR-4+TG150, minimum hole 0.35mm, copper thickness 1OZ, line width line spacing 3/3mil,Impedance Ω ± 10%
4. Surface treatment: Gold Finger + Electric Thick Gold 20U "
5. Quantities range from prototype to volume production.
6. 100% E-Test
7. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
8. Printed circuit board (pcb) and PCBA product areas
   Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
   Winding circuit board (fpc) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Your single point of contact for all of your raw materials, parts, and pcb assembly, also offers

1. - Contract Manufacturing
2. - Engineering Services
3. - PCB Design & Assembly
4. - Product Design
5. - Prototyping
6. - Cable and Wire Assemblies
7. - Plastics and Molds

8. Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

   PCB, FPC product application field

   Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

   FAQ:

   Q: What files do you use in PCB fabrication?

   A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

   Q:

   Is it possible you could offer sample?

   A: Yes, we can custom you sample to test before mass production

   Q: When will I get the quotation after sent Gerber, BOM and test procedure?

   A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

   Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

   A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

   Q: How can I make sure the quality of my PCB?

   A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

   PCB, FPC process production capability

   Technical ltem		MassProduct		Advanced Technology
   		2016		2017		2018
   Max.Layer Count		26L		36L		80L
   Through-hole plate		2～45L		2～60L		2～80L
   Max.PCBSize(in)		24*52"		25*62"		25*78.75"
   The layer number of FPC		1～36L		1～50L		1～60L
   Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
   Layeredplatelayer		2～12L		2～18L		2～26L
   Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
   Combination of hard and soft layers		3～26L		3～30L		3～50L
   Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
   HDI PCB		4～45L		4～60L		4～80L
   Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
   Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
   Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
   Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
   Build-up Material		FR-4		FR-4		FR-4
   BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
   	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
   	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
   	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
   	MAX(mm)	3.5		10.0mm		10.0mm
   Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
   Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
   BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
   	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
   Gold thick		1～40u"		1～60u"		1～120u"
   Nithick		76～127u"		76～200u"		1～250u"
   Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
   Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   DieletricThickness		38(1.5)		32(1.3)		32(1.3)
   		125(5)		125(5)		125(5)
   SKipvia		Yes		Yes		Yes
   viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
   Laser Hole Filling		Yes		Yes		Yes
   Technicalltem				Mass Product		Advanced Technolgy
   				2017year		2018year	2019year
   Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
   Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
   Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
   Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   BGAPitch mm(Mil)				0.3		0.3	0.3
   Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
   Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
   		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
   		≦3mil		±0.60		±0.60	±0.60
   Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
   		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
   		Multi-layer overlay		N+N		N+N	N+N
   				N+X+N		N+X+N	N+X+N
   		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

   PCB, FPC main material supplier

   NO	supplier		Supply material name			Material origin
   1	Japan		High frequency materials, PI, covering membrane,Copper berth			Mitsubishi Japan
   2	dupont		High frequency materials, PI, covering film, dry film,Copper berth			Japan
   3	panasonic		High frequency materials, PI, covering membrane,Copper berth			Japan
   4	SanTie		PI, covering membrane			Japan
   5	Born good		FR-4,PI,PP,Copper berth			shenzhen, China
   6	A rainbow		PI, covering membrane,Copper berth			Taiwan
   7	teflon		High frequency materials			The United States
   8	Rogers		High frequency materials			The United States
   9	Nippon Steel		PI, covering membrane,Copper berth			Taiwan
   10	sanyo		PI, covering membrane,Copper berth			Japan
   11	South Asia		FR-4,PI,PP,Copper berth			Taiwan
   12	doosan		FR-4,PP			South Korea
   13	Tai Yao plate		FR-4,PP,Copper berth			Taiwan
   14	Alight		FR-4,PP,Copper berth			Taiwan
   15	Yaoguang		FR-4,PP,Copper berth			Taiwan
   16	Yalong		FR-4,PP			The United States
   17	ISOAL		FR-4,PP			Japan
   18	OAK		Buried, buried resistance, PP			Japan
   19	United States 3M		FR-4,PP			The United States
   20	Bergs		Copper and aluminum matrix			Japan
   21	The sun		ink			Taiwan
   22	Murata		ink			Japan
   23	generous andbenevolent		PI, covering membrane,Copper berth			China's jiangxi
   24	Yasen		PPI, covering membrane			China jiangsu
   25	Yong Sheng Tai		ink			China guangdong panyu
   26	mita		ink			Japan
   27	Transcript		ceramic material			Taiwan
   28	HOME		ceramic material			Japan
   29	Fe-Ni-Mn		Alloy Invar, Section Steel			Taiwan