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High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
Specifications
Brand Name :
China chao sheng
Model Number :
Soft And Hard Combination Production + SMT+TEST+DIP
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
usd16.98pcs/pcs
Payment Terms :
T/T, Western Union
Supply Ability :
10-200K/pcs per month
Delivery Time :
15-20day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product area :
Military system products
Board Thickness :
3.50mm
Minimum Hole :
0.10mm
Copper Thickness :
1/1/1/1/1/1/1/11/1/1/1/1/oZ
Product Structure :
42layer4rdHDI RO4350B+C-Ply+Nelco 4000-13EP High frequency mixed pressure high speed PCB
Impedance Value :
±10%
TEST :
100% Electrical Test Prior Shipment
Description

42layer4rdHDI RO4350B+C-Ply+Nelco 4000-13EP High frequency mixed pressure high speed PCB except RoHS Lead Free Control Board Surface Mount Pcb Assembly BGA 0.20mm PCB Service circuit bo

PCBA packaging method: Anti-static bag + Anti-static bubble wrap + Good quality carton box

Product Description

Product area: Military system products

Product structure: 42layer4rdHDI RO4350B+C-Ply+Nelco 4000-13EP High frequency mixed pressure high speed PCB, inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, plate thickness 3.50mm, Immersion gold 2u", SMT + plug-in + post-welding

  1. Size: 256mm*158mm
  2. Copper Thickness: 1/1/1/1/1/1/1/11/1/1/1/1/oZ
  3. Min. Hole Size: 0.10mm
  4. Min. Line Width: 0.07mm
  5. Min. Line Spacing: 0.075mm
  6. Hole vias: Buried hole and blind hole

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

PCB Assembly services

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspectio

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)

Advantages
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free ControlHigh Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control

Product tags

duplex steel pipe fittings

,

silicone-core pipe coupler

,

bspt pipe fittings
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High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control

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Product Detail
Brand Name :
China chao sheng
Model Number :
Soft And Hard Combination Production + SMT+TEST+DIP
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
usd16.98pcs/pcs
Contact Supplier
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control
High Frequency Through Hole Pcb Assembly Mixed Pressure PCB Except RoHS Lead Free Control

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PCB Board Service, PCB Assembly Services, PCB Prototype Service
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
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