12 layers Level 3HDI​ Large motor motor PCB HDI FR-4, TG150 Thick copper + thick gold inner and outer copper ,HDI Printed Circuit Boards,prototype pcb fabrication

Product Description

1:12 layers Level 3HDI​, Bluetooth headset left and right board
2: FR-4, TG150, inner and outer copper thickness 35um, minimum line width line spacing 4/4mil, hole ratio 12:1, minimum hole 0.10mm, blind hole buried hole, sinking gold, green oil, white
3: The plate thickness is 1.70mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

1. Product area: Inductive drive products
2. Number of layers: 8layers of second-order HDI,minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance Ω±10%, Resin plug hole + copper fill hole
3. Plate thickness: 1.60mm
4. Product structure: FR-4, TG150, inner and outer copper thickness 1OZ, impedance ±10%
5. Solder mask green, immersion gold 15u"
6. Quantities range from prototype to volume production.
7. 100% E-Test
8. Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton
9. LED: military, medical, laser, hole, optical and other LED small pitch PCB
   Product structure: 8ayers Level 2 HDI​
   Material: FR-4, TG170, halogen-free
   Board thickness: 1.60MM
   Size mm:
   Impedance value: ± 10%
   Minimum hole: 0.15mm
   Minimum line width and space:
   aspect ratio:
   Surface treatment: immersion gold, electro-nickel gold, immersion tin, OSP, lead-free spray tin
   Provide PCB information: Gberber, production requirements, MOQ quantity
   PCBA information: BOM report, X, Y left plot

Our Service

1. PCB Production Service.
2. PCB FPC design Service.
3. PCB Assembly Service. (SMT, BGA, DIP)
4. PCBA Housing assembly serivce.
5. PCBA Final Functional Testing.
6. PCB PCBA Copy Service.
7. Electronic Components Purchasing & BOM List Purchasing Services.
8. PCB SMT Stencil. (Laser cut & Etching)

9. Quality Assurance:
   Our Quality processes include:
   1. IQC: Incoming Quality Control (Incoming Materials Inspection)
   2. First Article Inspection for every process
   3. IPQC: In Process Quality Control
   4. QC: 100% Test & Inspection
   5. QA: Quality Assurance based on QC inspection again
   6. Workmanship: IPC-A-610, ESD
   7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

   Certificates:
   ISO9001-2008
   ISO/TS16949
   UL
   IPC-A-600G and IPC-A-610E Class II compliance
   Customer's requirements

   Quick Detail:

   1. PCB Assembly on SMT and DIP

   2. PCB schematic drawing/ layout /producing

   3. PCBA clone/change board

   4. Components sourcing and purchasing for PCBA

   5. Enclosure design and plastic injection molding

   6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

   7. IC programming

   PCB, FPC product application field
   Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

   FAQ:
   Q: What files do you use in PCB fabrication?
   A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
   Q: Is it possible you could offer sample?
   A: Yes, we can custom you sample to test before mass production
   Q: When will I get the quotation after sent Gerber, BOM and test procedure?
   A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
   Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
   A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
   Q: How can I make sure the quality of my PCB?
   A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

10. PCB, FPC process production capability

    Technical ltem		MassProduct		Advanced Technology
    		2016		2017		2018
    Max.Layer Count		26L		36L		80L
    Through-hole plate		2～45L		2～60L		2～80L
    Max.PCBSize(in)		24*52"		25*62"		25*78.75"
    The layer number of FPC		1～36L		1～50L		1～60L
    Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
    Layeredplatelayer		2～12L		2～18L		2～26L
    Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
    Combination of hard and soft layers		3～26L		3～30L		3～50L
    Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
    HDI PCB		4～45L		4～60L		4～80L
    Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
    Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
    Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
    Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
    Build-up Material		FR-4		FR-4		FR-4
    BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
    	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
    	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
    	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
    	MAX(mm)	3.5		10.0mm		10.0mm
    Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
    Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
    BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
    	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
    Gold thick		1～40u"		1～60u"		1～120u"
    Nithick		76～127u"		76～200u"		1～250u"
    Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
    Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    DieletricThickness		38(1.5)		32(1.3)		32(1.3)
    		125(5)		125(5)		125(5)
    SKipvia		Yes		Yes		Yes
    viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
    Laser Hole Filling		Yes		Yes		Yes
    Technicalltem				Mass Product		Advanced Technolgy
    				2017year		2018year	2019year
    Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
    Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
    Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
    Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    BGAPitch mm(Mil)				0.3		0.3	0.3
    Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
    Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
    		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
    		≦3mil		±0.60		±0.60	±0.60
    Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
    		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
    		Multi-layer overlay		N+N		N+N	N+N
    				N+X+N		N+X+N	N+X+N
    		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole