MachineU > China Products > Fabrication Services > Machining Services
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger
Specifications
Brand Name :
China chao sheng
Model Number :
Medical Bluetooth module motherboard
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
2.56USD/PCS
Payment Terms :
T/T, Western Union
Supply Ability :
5-200K/pcs per month
Delivery Time :
18-25day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Cnc machining or not :
CNC Machining
Material capabilities :
Aluminum
Material :
Aluminum
Product name :
ITG 70 Customized High Precision Aluminum PCB Enclosure Profile Box
Application :
Automotive
Service :
OEM/ODM availabe and welcome
Keyword :
CNC Macining Parts
Color :
Multi colors
Equipment :
CNC Machining Centres
Oem service :
yes
Size :
Customized Size
Provided by :
Gerber/PCB File Needed/BOM
Description

8 layers HDI third-order, half-hole + metal edging + gold finger pcb rapid prototyping prototype pcb service pcb service

1: Medical Bluetooth module motherboard
2: FR-4, TG170, inner and outer copper thickness 35um, minimum line width line spacing 4/4mil, hole ratio 16:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.80mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

Product tags

ultra thick pcd blanks for micro drill

,

quick turn pcb fabrication

,

thin-wall diamond core bits
Send your message to this supplier
Send Now

8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger

Ask Latest Price
Product Detail
Brand Name :
China chao sheng
Model Number :
Medical Bluetooth module motherboard
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
2.56USD/PCS
Contact Supplier
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger
8 Layers HDI Third Order Pcb Rapid Prototyping Prototype Half - Hole Metal Edging Gold Finger

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PCB Board Service, PCB Assembly Services, PCB Prototype Service
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products PCB Prototype Service
MachineU China Products Fabrication Services Machining Services
Contact Supplier
Submit Requirement