Specifications
Brand Name :
China chao sheng
Model Number :
CSPCB1518
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
1.02usd/PCS
Payment Terms :
L/C, T/T, Western Union, MoneyGram
Supply Ability :
200K/pcs per month
Delivery Time :
15-20day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product field :
Automotive energy
material :
DuPont PI
Board Thickness :
0.35 Mm
Min. Line Spacing :
0.1mm(4mil)
Surface Finishing :
ENIG
Copper Thickness :
25um
Product Structure :
6-layer FPC + SMT
Product Name :
Flexible Printed Circuit Board FPC Manufacturer,Customized OEM Flexible Circuit Double-sided FPC
Item :
FPC/flex FPC/flexible FPC/Rigid
TEST :
100%
Description

8-layer FPC + SMT + TEST + DIP, SMT FPC Service, rigid flex FPC manufacturers, flexible printed FPC, multilayer FPC, flexible FPC

Product Description

Specifications
Our professional engineering team can put your project into production in a short time. Sample pictures and
BOM are needed to make customized products.Also we can supply for the copy of the FPC and FPCA, so you
just sent me the enquiry is ok, we can do what you need to do!
We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured
according to customers' requests or samples. Plastic injection processing available.
Purchasing the electronic components for you to the production of the FPCA
We have advanced equipment for through-hole and SMT DIP COB cable Assembly

Product Details

  1. 4-12-layer FPC production + SMT+TEST+DIP,SMT PCB Service,wooden box,rigid flex pcb manufacturers,high speed pcb layout
  2. FPCBA processing method,Six-layer FPCHDI, laser hole 0.10mm, mobile phone motherboard,
  3. FPC production + it contains SMT, DIP, TEST,
  4. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCB capability and services:

  1. Single-sided, double-sided & multi-layer FPC (up to 30 layers)
  2. Flexible PCB (up to 10 layers)
  3. Rigid-flex PCB (up to 8 layers)
  4. PI High TG, Polyimide, Aluminum-based material.
  5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
  6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
  7. Quantities range from prototype to volume production.
  8. 100% E-Test

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Detailed Specification of PCB Manufacturing

1 layer 1-30 layer
2 Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

Aluminum-based material.

3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

Hard Gold, OSP

9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling

PCB Assembly services:


Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

Testing Methods


AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

Detailed Specification of Pcb Assembly

1 Type of Assembly SMT and Thru-hole
2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
3 Components Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
3 Bare Board Size Smallest:0.25x0.25 Inches
Largest:20x20 Inches
4 File Formats Bill of Materials
Gerber Files
Pick-N-Place File(XYRS)
5 Type of Service Turn-Key,Partial Turn-Key or Consignment
6 Component Packaging Cut Tape
Tube
Reels
Loose Parts
7 Turn Time 15 to 20 days
8 Testing AOI inspection
X-Ray inspection
In-Circuit testing
Functional test

FAQ:

Q: What files do you use in FPC fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for FPC quotation and around 24-48 hours for FPCA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my FPC production?

A: 7-35days for FPC production and components purchasing, and 14-20days for FPC assembly and Testing

Q: How can I make sure the quality of my FPC?

A: We ensure that each piece of FPC, FPCA products work well before shipping. We'll test all of them according to your test procedure.

Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy

Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy

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Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy

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Brand Name :
China chao sheng
Model Number :
CSPCB1518
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
1.02usd/PCS
Contact Supplier
Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy
Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy
Rigid Flexible Pcb Board 8 Layer FPC SMT TEST DIP Service For Automotive Energy

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
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