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12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
Specifications
Brand Name :
China chao sheng
Model Number :
cspcb1517
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
2.20usd/PCS
Payment Terms :
T/T, Western Union
Supply Ability :
200K/pcs per month
Delivery Time :
15-18day
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Base Material :
FR4,Copper Film/Cover Film
Board Thickness :
1.6mm
Min. Line Width :
0.1mm
Surface Finishing :
ENIG
Application :
Electronics Device
Service :
ODM OEM EMS,PCB&PCBA
Copper Thickness :
1/2OZ 1OZ 2OZ 3OZ
Product Name :
Flexible PCB Strip Supplier
E-Test :
100%
Description

12 layers PCB Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure HDI Printedprinted circuit board pcb multilayer

We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,60 layersHDI,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.

pcb board

Process parameters:

Content Capability
Material FR4, TG130, TG140, TG160, TG170 TG180 TG240
Surface treatment HASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger
Layers Single-sided,double-sided,4 layers, 6,8,10,20 30 40 60 Layers
Maxi. board size 800mmX508mm
Line width/space 0.1mm/ 0.1mm
Board thickness 0.2mm-4mm
Min.tolerance of Board thickness +/-8% - 10%
Copper foil thickness

Out Layer:17.5um/35um/70um/105um/140um/175um

Inner Layer:17.5um/35um/70um/105um/140um
Outline Tolerance CNC routing:+/-0.1mm , Punching: +/-0.1mm
V-CUT registration +/-0.15mm
PTH hole copper thickness 15um-50um
Warp and twist <=1%
Min registration of hole position +/-3mil(+/-0.76mm)
Min punching hole 0.8mm(Board thickness below 1.0mm .)
Min Punching Square slot (Board thickness below 1.0mm, 1.0mmX1.0mm)
Registration of printed circuit +/-0.076mm
Min drill hole diameter 0.2mm
Min tolerance of hole diameter +/-0.05mm
Thickness of surface treatment

Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um)

Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um)

Plating Silver:(Ag 5um-8um)
V-CUT degree tolerance +/-5(degree)
V-CUT Board thickness 0.6mm-3.2mm
Min Legend width 0.1mm
Min Solder mask width 0.1mm
Min Solder mask ring 0.05mm
  1. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements

Quick Detail:

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

7. IC programming

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

Tag:

electronic assembly services,

electronic pcb assembly

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan

12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

Product tags

silicon wafer orientation

,

surface mount pcb assembly

,

fabrication fr4 pcb
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12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

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Product Detail
Brand Name :
China chao sheng
Model Number :
cspcb1517
Certification :
ISO/UL/RoHS/TS
Place of Origin :
Shenzhen, Guangdong, China
MOQ :
1PCS
Price :
2.20usd/PCS
Contact Supplier
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure
12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Active Member
6 Years
hong kong, hong kong
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PCB Board Service, PCB Assembly Services, PCB Prototype Service
Total Annual :
716277898-736287698
Employee Number :
2500~2768
Certification Level :
Active Member
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