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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Specifications
Brand Name :
YUSH
Model Number :
YSL-1000SD
Certification :
CE Mark
Place of Origin :
JiangSu
MOQ :
1 set
Price :
business negotiation
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
25 Set/Sets per Month
Delivery Time :
3 days to 7 days
Packaging Details :
wooden package
Dimensions of processing :
300mm
Power :
2.4KW
Speed :
5000-60000Rpm
Machine power :
4KW
Power air pressure :
0.5 ~ 0.6 MPa
Cutting speed :
0.05 ~ 400 mm/sec
Description
Basic Description
The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Operation procedures
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Wafer or Strip Tape mounting Dicing Cleaning UV seperation
Description of Semi-auto dicing
The semi-auto dicing system, refers to a dicing system that loader and unloader by hand and only the procedure is automated in the process of dicing. The system is not equipped with automatic cleaning, drying, etc.
Main procedures
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Feeding by hand Position align Auto-cutting Unloading by hand
1.Operator manually place the material being cut on work platform.

2.The cutting position is automatically calibrated.

3.Press the start button to automatically complete the dicing process of material.

4.Operator take the material manually being cut from the work platform.

Applications

Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Ceramic substrate Silicon rubber Lead frame
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Silicon wafer PCB Glass
Operating Requirements
1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.

3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).

4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

6.Please follow the product manual we provided for operation strictly.

Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

Semi-dicing system YSL-1000SD Features of products
1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
2.Can meet the high precision cutting maximum diameter of 300 mm materials.
3.High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
4.CCD automatic align.
5.Real-time monitoring of the system's air pressure, water pressure, current and other values to avoid spindle damage.
6.Cutting Spindle : 2.4 kw × 1set (Max: 60,000 rpm)
7.Repeat positioning accuracy: 0.001mm
8.Cutting speed: 0.05 ~ 400 mm/sec
9.Standard matching blade: 2 Inch (Max: 3 Inch)
Case Sharing
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

System compositionproject Unit Specification
Dimensions of processing mm Φ300
Dimensions of working platform mm Φ350
X-axis Working stroke mm 340
Cutting speed mm/sec 0.05 ~ 400
Resolution mm 0.0001
Y-axis Working stroke mm 310
Resolution mm 0.0001
Repeat positioning accuracy mm 0.001 / 310
Z-axis Working stroke mm 60 (2 Inch blade)
Resolution mm 0.0001
Θ-axis Angle of rotation Deg 360
Spindle Power KW 2.4
Speed Rpm 5000 ~ 60000
Machine’s specifications Power supply V 3P 220 (50 ~ 60 Hz)
Machine power KW 4
Power air pressure MPa 0.5 ~ 0.6
Air consumption L/min 200
Cutting water consumption L/min 4
Cooling water consumption L/min 1.5
Physical dimension mm 1040×1080×1750
Machine net weight KG 850

Other Discription
Optional equipment
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.
Product tags

diamond cutting discs toolstation

,

cut silicon wafer

,

tempered glass cutting board
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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

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Product Detail
Brand Name :
YUSH
Model Number :
YSL-1000SD
Certification :
CE Mark
Place of Origin :
JiangSu
MOQ :
1 set
Price :
business negotiation
Contact Supplier
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

YUSH Electronic Technology Co.,Ltd

Verified Supplier
11 Years
jiangsu, suzhou
Since 2005
Business Type :
Manufacturer
Main Products :
PCB Depaneling Machine, PCB Depaneling Router, PCB Separator
Total Annual :
10000-50000
Employee Number :
1000~2000
Certification Level :
Verified Supplier
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