MachineU > China Products > Machinery > Electronics Production Machinery
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Specifications
Brand Name :
YUSH
Model Number :
YSL-2000AD
Certification :
CE Mark
Place of Origin :
JiangSu
MOQ :
1 set
Price :
business negotiation
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
25 Set/Sets per Month
Delivery Time :
3 days to 7 days
Packaging Details :
wooden package
Dimensions of processing :
300mm
Power :
2.4*2 set KW
Speed :
5000-60000Rpm
Machine power :
8KW
Power air pressure :
0.6 ~ 0.68 MPa
Standard collocation of using blade size :
2 Inch(Max:3 Inch)
Description
Basic Description
The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Operation procedures
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Wafer or Strip Tape mounting Dicing Cleaning UV seperation

Description of Auto dicing

Auto-dicing system, refers to a dicing system which all using full automatic operation from a series of processes of feeding, position calibration, cutting, cleaning / drying and unloading.
Main procedures
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

Feeding Position align Auto-dicing cleaning /drying Unloading automatically
automatically
1. Remove the dicing material automatically and transfer to the working platform from the magazine .

2.The dicing position align automatically.

3. Complete the dicing process of material automatically .

4. Use pure water and compressed air to clean and dry the dicingmaterial.

5. Sent the dicing material automatically to the magazine .

Applications

Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Ceramic substrate Silicon rubber Lead frame
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Silicon wafer PCB Glass
Operating Requirements
1. Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2. Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.

3. Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).

4. Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

5. Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

6. Please follow the product manual we provided for operation strictly.

Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

Full Auto Dicing System YSL-2000AD Features of products

1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.

2. Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
3. Can meet the high precision cutting maximum diameter of 300 mm materials.
4.Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
5.CCD automatic align.
6.Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
7.Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
8.Repeat positioning accuracy : 0.001mm
9.Cutting speed: 0.05 ~ 400 mm/sec
10.Each magazine can be stored 20 ~ 30 layers of frame.
11.Standard collocation of using blade size: 2 Inch(Max:3 Inch)
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Processdescription
1.Mechanism remove it from magazine, and send it to the temporary table.
2.Unloading robot will move the dicing material tochunk.fordicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporarytable.
5.Robot send the dicing material to the magazine .
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Case Sharing
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

System compositionproject Unit Specification
Dimensions of processing mm Φ300
Dimensions of working platform mm Φ350
X-axis Working stroke mm 500
Cutting speed mm/sec 0.05 ~ 400
Resolution mm 0.0001
Y-axis Working stroke mm 650
Resolution mm 0.0001
Repeat positioning accuracy mm 0.001 / 310
Z-axis Working stroke mm 60 (2 Inch blade)
Resolution mm 0.0001
Θ-axis Angle of rotation Deg 360
Spindle Power KW 2.4*2 set
Speed Rpm 5000 ~ 60000
Machine’s specifications Power supply V 3P 220 (50 ~ 60 Hz)
Machine power KW 8
Power air pressure MPa 0.6 ~ 0.68
Air consumption L/min 250
Cutting water consumption L/min 6.5
Cooling water consumption L/min 2.5
Physical dimension mm 1262*1704*2023
Machine net weight KG 1900


Other Discription

Optional equipment
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.
Product tags

v cut pcb depaneling machine

,

aac blocks cutting machine

,

cut silicon wafer
Send your message to this supplier
Send Now

Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

Ask Latest Price
Product Detail
Brand Name :
YUSH
Model Number :
YSL-2000AD
Certification :
CE Mark
Place of Origin :
JiangSu
MOQ :
1 set
Price :
business negotiation
Contact Supplier
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

YUSH Electronic Technology Co.,Ltd

Verified Supplier
11 Years
jiangsu, suzhou
Since 2005
Business Type :
Manufacturer
Main Products :
PCB Depaneling Machine, PCB Depaneling Router, PCB Separator
Total Annual :
10000-50000
Employee Number :
1000~2000
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products PCB Depaneling Machine
MachineU China Products Machinery Electronics Production Machinery
Contact Supplier
Submit Requirement