The G9+ automatic tin paste printing press is a high-end model forSMT high-end application,which can satisfy the printing process requirements of 03015, 0.25 pitch, high precision and high speed.
Features:
Total new optical path system, uniform circular light and high brightness ofcoaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mark point can be easily recognize(including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of differentPCB collor
Extremely reliable structure with stable XY movement. Manual adjustment makes it a breeze to accommodate differentPCB thickness.
New pattern patented guide rail can detachable,programmable flexible side clamp, specific to FPC,PCBwarpage, perform a unique damping
plate device. Through software programming can automatically stretch out and draw back unaffected PCB thickness.
Adopt a comprehensive squeegee system which enhances stability an shelf-ife.
Substrate processing | G9+ |
Maximum board size | 450*340mm |
Minimum board size | 50*50mm |
Board thickness | 0.4~6mm |
Maximum board weight | 3Kg |
Board edge clearance | 2.5mm |
Board height | 15mm |
Transport height | 900±40mm |
Transport speed | 1500mm/s(Max) Program Control |
Transport direction | One stage |
Board clamp | Patented over the top clamping |
Side clamping | |
Adsorption function | |
Spport System | Magnetic Pin |
Support Block | |
Manual up-down table |
Printing Parameters | G9+ |
Snap-off | 0-20mm |
Print Mode | One/Twice |
queegee Type | Rubber/Steel Squeegee Blade(angle 45/55/60) |
Print Speed | 10~200mm/sec |
Print Pressure | 0.5~20Kg |
The template frame size | 470*370mm~737*737mm |
Cleaning System | Drops of rain type cleaning system |
Reinforced Vacuum absorption | |
Dry, Wet Vacuum three modes | |
Back and forth cleaning |
Machine Performance | G9+ |
Repeat Position Accuracy | ±10um@6σ,CPK≥2.0 |
Print Accuracy | ±18um@6σ ,CPK≥2.0 |
Cycle time | <7sec |
Based on the third party test system(CTQ)Verify the actual solder paste printing |
Vision | G9+ |
---|---|
CCD FOV | 10*8mm |
Fiducial mark types | Fiducial mark types |
Hole | |
Pad | |
Camera System | Look up/down optics structure |
CCDdigital camera | |
Geometry pattern match |