PCB Solder Paste Printer YSL-H510
Features
1,Applicatelinear motor - high speed and high precision
2,The printing leader of 03015micro component
3,New mechanical design-more stable and convenient
4,New printing head design-high printing quality
Overall diagram
1,Machine housing module
2,Squeegee printing module
3,Stencil frame positioning module
4,Platform lifting module
5,leaning module
6,CCD image capture module
7,Rail and conveyor module
8,JThree color warning lamp
9,Display and input device
Screen Frame Size(mm) | 650(X)X550(Y)-737(X)X737(Y) |
Thickness:20-40mm | |
Min PCB(mm) | 50(X)x50(Y)mm |
Max PCB(mm) | 510(X)x510(Y)mm |
Thickness | Use jig when pcb less than0.4mm) |
Curve | <1%(Diagonal measurement) |
PCB backside Part Height | 18mm |
Conveyor height | 900±40mm |
Support | Magnetic support,Magnetic piece,Vacuum chamber |
Clamp | Side clamp and top clamp |
Edge distance | PCB process edge≥2.5mm |
Conveyor speed | 0-1500mm/sec,increment 1mm |
Conveyor belt | U type sync belt |
Stopper method | Air cylinder |
Stopper position | Set the PCB stopper position according to the size of board |
Flow direction | Software profile |
Print speed | 5-200mm/s adjustable |
Print head | Servo motor drive scraper lifting |
Scraper | Steel scraper,rubber scraper (option) |
Scraper angle | 60° |
Scraper pressure | 0~20kg |
Substrate Separation | Three-section Substrate Separation |
Alignment position method | Mark Automatic aligning |
Camera | Germany BASLER, 1/3 "CCD, 640*480 pixel pixel, pixel size 5.6umx5.6μm |
Acquire image method | Upper/under double photo |
Camera light | Coaxial light,Ring light four kinds light can adjustable |
View range | 9mm*7mm |
Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% |
Mark shape | Cir,Rec,or rhombus etc |
Mark position | PCB dedicated mark or PCB pad |
2Ddetection | / |
Table adjusting range | X=±10mm,Y=±10mm,θ=±2° |
Positional accuracy | ±0.01mm |
Printing accuracy | ±0.015mm |
Cycle time | <7.5s(cleaning time) |
Convert line time | <5min |
Programming time | <10min |
Computer configuration | Industrial PC,Windows official system |
System language | Chinese,English |
Pre and next machine connection | SMEMA |
User authorization | User PW and Senior PW set |
Cleaning system | Dry and Wet(standard),vacuum model(optional) |
Liquid level detection | Liquid level auto alarm detection |
Main power supply | AC 220V±10%50/60HZ Single phase |
Total power | About 3kw |
Main air supply | 4.5~6kgf/cm2 |
Machine weight | about 1300Kg |
Machine dimensions | 1350(L)x1625(W)x1535(H)mm |
Pneumatic top clamp | Standard |
Top damp +side clamp | For PCB(thickness≤1mm) |
Vacuum adsorption and clean | ForPCB(thickness≤1mm) and FPC |
Autotinadded | / |
Auto loading and unloading | / |
Flexible and universal support | For the Double-sidedPCB(PCB backside parts Height≤9mm) |
Automatic positioning of screen frame | Standard |
PCB board thickness automatic adjustment function | / |
Scraper pressure feedback function | / |
Air condition | Customer can buy by themselves |
The rest of solder paste | / |
SPI close loop | SPI close loop |
UPS power offprotection | power offprotection |
Industry 4.0 | Bar code trace function,Production analysis,etc |