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Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force
Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force
Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force
Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force
Specifications
Brand Name :
Winsmart
Model Number :
SMTS42
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
USD1-10000/Set
Payment Terms :
L/C, T/T, Western Union
Supply Ability :
200 sets per month
Delivery Time :
5-8 days
Packaging Details :
Plywood case
Usage :
Pulse heat
Color :
White
Voltage :
220V/110V
Temperature Accuracy :
±2°C
Thermode :
Molybdenum alloy
Name :
Pulse Heat Bonding Machine
Description

Pulse Heat Bonding Machine PCB Soldering Machine Hotbar Machine

Pulse Heat Bonding Machine Principle:

The hot bar power supply provide the current to heat the thermode which is high resistivity such as W,Mo,Ti. The temperature climb up to a certain value to melt theTIN and the solder, when the temperature drop down, the workpiece is connected by the TIN. A pressure is working through all the process and the temperature is accurately controlled by the IGBT inverter power supply.

Pulse Heat Bonding Machine Features:

Unique pulse heat technology provides fastest soldering head heating.

Programmable soldering temperature, heat-up rate and time duration for a wide range of products.

Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.

Closed Loop PID temperature control with clearly visible LED display.

Soldering time can be programmable and is triggered by temperature.

Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.

Programmable pressure switch with LCD display for precise force control.

CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.

Pulse Heat Bonding Machine Specification:

Machine size 680×780×750mm
Working area Max 200*260mm
Machine weight 135Kg
Working air pressure 0.4-0.6Mpa
Fixture quantity 2
Thermode head size Max 80*5mm
Welding precision pitch 0.2mm
Pressing time 1~99.9s
Temperature settings RT~500℃ tolerance ±5℃
Welding pressure 1~20Kg
Temperature settings Two
Working environment 10-60℃,40%-95%
Power supply AC220V±10% 50HZ,2200W
Alignment mode CCD + LCD Monitor
Feeding mode Manual
Starting mode Press start button
Rotation Platform Cylinder control,tolerance<0.02mm

Pulse Heat Bonding Machine Details:

Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force

Pulse Heat Bonding Machine Applications:

Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force

Heat Sealing Paratmeter:

1. Temperature range: 50℃ to 600℃

2. Temperature accuracy: ±1°C

3. Bond timer: 0-12 seconds

4. Bond air pressure: 0.4-0.6MPa

5. Pressure accuracy: ±0.05MPa

6. Max bond force: 1100N

Product tags

heat bonding machine

,

bonding machine acf

,

pcb soldering temperature
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Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force

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Product Detail
Brand Name :
Winsmart
Model Number :
SMTS42
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
USD1-10000/Set
Contact Supplier
Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force
Pulse Heat PCB Bonding Machine 2°C Temperature Accuracy 1100N Bond Force

Winsmart Electronic Co.,Ltd

Verified Supplier
5 Years
guangdong, huizhou
Since 2008
Business Type :
Manufacturer, Exporter, Seller
Main Products :
PCB Depaneling Router Machine, V Cut PCB Depaneling Machine, Laser PCB Depaneling Machine
Total Annual :
400,000.00-500,000.00
Employee Number :
40~60
Certification Level :
Verified Supplier
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