Rigid Print Circuit Board 20W UV Laser Cutting Equipment Without Stress

Laser Cutting Equipment Description:

The laser cutting equipment can cut various types of PCB circuit boards with V-CUT and stamp holes, and divide the encapsulated circuit boards and ordinary optical boards. It is suitable for laser cutting and depaneling PCB circuit boards made of soft and hard combination boards, FR4, PCB, FPC, fingerprint identification module, covering film, composite materials, copper substrate and other materials.

According to the demand, UV and green laser can be used to cut and separate the PCB, and various types of PCB circuit boards with V-CUT and stamp holes can be precisely cut The equipment supports automatic loading and unloading cutting, which can realize automation

Laser Cutting Equipment Characteristics:

1. High performance UV / green laser is adopted, with small laser focusing spot and narrow notch.

2. The board cutting process shall be clean and free of dust to avoid circuit failure caused by conduction caused by waste.

3. The PCB board that has been pasted can be divided directly. There is no contact and stress during cutting.

4. High precision two axis working platform, high precision and fast speed.

5. CCD can be used for automatic positioning and correction.

6. The processing is automatically controlled by computer software, and the software interface gives real-time feedback to understand the processing status in real time.

Laser Cutting Equipment Specification:

Laser Cutting Equipment Applicable Industry:

It is suitable for cutting various types of PCB substrates, such as ceramic substrates, soft and hard bonding plates, FR4, PCB, FPC, fingerprint identification module, covering film, composite materials, copper substrates, etc.