Stable ACF Hot Bar Soldering Machine Automatic ACF Film Bonding Machine

ACF Film Bonding Machine Application:

For a variety of high density ACF, TAB, TCP crimping and FPC, FFC and PCB solder crimp.

ACF Film Bonding Machine Parameters:

Machine size:680×780×750mm

Working area:Max 260x200mm

Machine weight:135Kg

Working air pressure:0.6-0.8Mpa

Power supply:AC220V±10% 50HZ,2200W

Temperature settings:Two

Working environment:10-60℃,40%-95%

Welding pressure:1~20Kg

Temperature settings:RT~400℃ tolerance ±5℃

Pressing time:1~99.9s

Welding precision:pitch 0.2mm

Thermode head size:Max 80*8mm

Fixture quantity: 2

Feeding mode:Manual

Starting mode:Press start button

Rotation Platform:Cylinder control,tolerance<0.02mm

Double Station Hot Bar Welding Machine Specification:

ACF Film Bonding Machine Advtanges:

1. Very high working efficiency, suitable for high volume production.

2. Max 10mm long thermode head for larger applications.

3. Molybdenum alloy thermode heads have uniform heating and high welding quality.

4. Customized fixtures are available for high quality soldering of different applications.

5. Imported PLC system ensures stable running.

ACF Film Bonding Machine Features:

1.Unique pulse heat technology provides fastest soldering head heating.

2.Programmable soldering temperature, heat-up rate and time duration for a wide range of products.

3.Thermocouple is fixed in close proximity to the working surface & the

thermode, thus providing accurate temperature feedback control.

4.Closed Loop PID temperature control with clearly visible LED display.

5.Soldering time can be programmable and is triggered by temperature.

6.Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.

ACF Film Bonding Machine Case: