MCGS Touch Screen Control Manual & Automatic Laser Position BGA Rework Station

Introduction

A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging to repair when defects occur.

Features:

1.Automatic&Manual operation system.

2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

3.MCGS touch screen control.

4.Laser position.

5.Repair success rate 99.99%.

​Specification:

Applications

BGA Component Replacement:
Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
Solder Joint Repair:
Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
Prototyping:
Useful in prototyping environments where BGA components need to be frequently replaced or modified.
Quality Control:
Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.

Benefits

Increased Reliability:
Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
Cost-Effective Repairs:
Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
Enhanced Precision:
Provides precise temperature control and alignment for high-quality rework results.
Time Efficiency:
Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
Flexibility:
Can handle various sizes and types of BGA components, making them versatile for different applications.