PCB SMT Board Handling Machine with Panasonic PLC, Fan, FIFO LIFO
Introduction
This PCB buffer machine is a smart board buffering equipment, it has 25 layers to store the PCBs, each layer has its individual
signal, and each layer has named a number, when the downstream machine give signal to layer number, the buffer will accept the
signal ans give order to the layer, then automatic select and transport the PCBs to the downstream machine.
Features
1, Panasonic PLC control.
2, Smart touch screen control panel.
3, With FIFO and By-pass function, or cutomized to multiple function.
4, Using servo motor for accuracy positioning.
5, Hiwin leadscrew for width adjustment, smooth and stable.
6, Smooth magazine lifting device, precision servo driving.
7, Optional fan and exhaust port for heat dessipation.
8, English operation interface.
9, The whole machine is small volume, won't take much factory space.
10, SMEMA communication interface, can be connected with other automation equipment.
11, Three color LED display for machine status.
Specification
Model: | HS-BF330 | ||||
Voltage: | AC220V,50/60Hz | ||||
PCB Dimension: | L(50*50)-(450*330)mm | ||||
Air supply: | 4-6 bar,max 15L/min | ||||
Transport height: | 900±20(mm) | ||||
Transport Direction: | L-R or R-L (optional) | ||||
PCB thickness: | min 0.46mm | ||||
Up/down pitches: | 1-4(10mm step) | ||||
Store Capacity | 25pcs or customized | ||||
Cycle time | Around 15 seconds | ||||
Communication | SMEMA | ||||
Optional | Fan, observation window | ||||
Certification | CE | ||||
Machine Dimension: | 600*1150*1560mm | ||||
Gross Weight: | 280kg |
SMT production line equipment
1. Universal SMT machine: Using the program edited by the device to mount components onto designated parts positions, it can mount SOP 28 pin or more (including components that can be mounted by high-speed machines) roll, disc, or tubular packaging components. Its characteristics are high precision and diversity, but its installation speed is inferior to high-speed machines.
2. Reflow soldering: Use SMT solder paste or red glue to set an appropriate temperature curve to complete the soldering action between the solder paste and the part.
3. Unloader: The board is loaded into the magazine through a transfer track.
4. Optical inspection instrument: Automatic optical inspection is a device based on optical principles to detect common defects encountered in welding production. AOI is a new testing technology that has only emerged in recent years, but has developed rapidly. Currently, many manufacturers have launched AOI testing equipment. When performing automatic detection, the machine automatically scans the PCB through a camera, collects images, compares the tested solder joints with qualified parameters in the database, processes the images, checks for defects on the PCB, and displays/marks the defects through a display or automatic marker for maintenance personnel to repair.