MachineU > China Products > Machinery > Other Machinery & Industry Equipment
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
Specifications
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Payment Terms :
T/T, Western Union, MoneyGram
Supply Ability :
100 sets per month
Delivery Time :
7~9 work days
Packaging Details :
Wooden package
Product Name :
Mobile Phone BGA Rework Station
Warranty :
1 Year
Control :
Touch screen
PLC :
MITSUBISHI
Relay Brand :
Schneider
Optoelectronic Switch :
OMRON
Material :
Aluminum Alloy
Condition :
New
Thickness :
0.3 - 5mm
Signal :
SMEMA
Application :
Electronic Assembly
Color :
Silver
Control System :
PLC
OEM/ODM :
Available
Total power :
2600W
Power Supply :
AC220V
Air Pressure :
4-6bar
Mounting accuracy :
±0.01mm
Type :
Automatic
Weight :
30KG
Description

5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station

​Specification

Mobile Phone BGA Rework Station Model:HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total power 2600W
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material Driving motor + smart temp. controller + color touch screen
Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor 1pcs
Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension L450mm*W470mm*H670mm
PCB size Max 140mm*160mm Min 5mm*5mm
BGA size Max 50mm*50mm Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 30KG
Mount chip weight 150g
Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc

Features

1. The upper and lower heating zone, temperature precision control within ±1℃, which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently.
2. Hot air district heating for BGA and PCB at the same time, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system.
4. Temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analysed, set and correct on the touch screen at any time.

About Packaging

High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

Send your message to this supplier
Send Now

High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

Ask Latest Price
Product Detail
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Contact Supplier
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

Shenzhen Hansome Technology Co., Ltd.

Verified Supplier
7 Years
guangdong, shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
PCB Handling Equipment, PCB Depaneling Router Machine, Automatic Soldering Robot
Total Annual :
2,000,000.00-3,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products PCB Handling Equipment
MachineU China Products Machinery Other Machinery & Industry Equipment
Contact Supplier
Submit Requirement