SMT Stencil Printer Solder Paste Stencil Printing Machine Width Adjustment
Specification
Model | GSE |
Stencil size | 370x370mm(min size) |
737x737mm(max size) | |
20-40mm(thickness) | |
Max PCB Size | 400x340mm |
Min PCB size | 50x50mm |
PCB thickness | 0.4-6mm |
PCB warpage | max 1% PCB diagonal |
Transport height | 900±40mm |
Transport direction | L-R,R-L |
Transport speed | max 1500mm/s, can be adjustment |
Transport method | One stage |
WIdth adjustment | automatic |
I/O interface | SMEMA |
PCB positioning (support method) | Magnetic pin/support block/up-down table |
PCB clamping system | Patented over the top clamping/side clamping |
Print head | Two independent motorised printheads |
Squeegee Pressure | 0.5~10Kg (Program Control) |
Print Speed | 6-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
Cleaning System | Ireinforced vacuum absorption ,dry ,wet, vacuum three modes |
CCD FOV | 8x6mm |
Machine adjust range | X: ± 3mm, Y:± 7 mm , θ:± 2° |
Vision | Look Up/Down Optics Structure/CCD/Geometry Pattern-match |
Whole Machine Specification
Repeat Position Accuracy | ±0.01mm |
Printing Accuracy | ±0.025mm |
Cycle Time | <8 Sec |
Product Changeover | old:<3 mins,new:<5 mins |
Air supply | 4~6 kgf/cm |
Power supply | AC:220±10%,50/60HZ, 2.5KW |
Control method | PC |
Operation system | Windows XP/Win7 |
Machine Dimensions | 1158(L) x 1362(W) x 1463 (H)mm |
Machine Weight | Approx: around 1000Kg |
Features
1, GKG special adjustment jacking platform. Stable and easy to adjust, it can quicklyadjust the pin jacking height of PCB with different thickness.
About Packaging