Automatic Solder Paste Printer for Industrial 4.0 MES System
Specification
Model | G9+ |
Max PCB Size | 450x340mm |
Min PCB size | 50x50mm |
PCB thickness | 0.4-6mm |
Max board weight | 5kg |
Transport height | 900±40mm |
Board edge gap | 2.5mm |
Board height | 15mm |
Transport direction | L-R,R-L |
Transport speed | max 1500mm/s, program control |
Transport method | One stage |
WIdth adjustment | automatic |
I/O interface | SMEMA |
PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
PCB clamping system | Patented over the top clamping |
Side clamping | |
Adsorption function | |
Print snap-off | 0-20mm |
Print mode | one/twice |
Print Speed | 10-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
Print pressure | 0.5-10kg |
Template fram size | 470*370mm~737*737mm(20-40thickness) |
Cleaning System | Droops of rain type cleaning system |
Reinforced vacuum absorption | |
Dry, wet vacuum three modes | |
Back and forth cleaning | |
CCD FOV | 10x8mm |
Fiducial mark types | Standard Fiducial mark shape |
Pad | |
Hole | |
Camera system | Look up/down optics structure |
CCD digital camera | |
Geometry pattern match |
Features
The CCD digital system showcases a groundbreaking optical path design, providing uniform circular lighting and bright coaxial illumination with infinitely adjustable brightness levels. This ensures flawless recognition of diverse mark points, even on uneven surfaces such as tin-plated, copper-plated, and silver-plated materials, hot-air soldering points, and various colored FPCs and PCBs.
The system boasts high-precision PCB thickness adjustment and a robust structure that guarantees stable XY movement, facilitating effortless manual adjustments to accommodate different PCB thicknesses.
The guide rail positioning system features an innovative, detachable pattern guide rail and a programmable, flexible side clamp specifically designed for FPCs and warped PCBs. Additionally, a unique clamping plate device controlled by software automatically adapts to various PCB thicknesses.
The squeegee structure design incorporates an advanced squeegee system that enhances stability and extends the squeegee's lifespan.
The high-speed stencil cleaning system features a downward dispensing cleaning structure that prevents clogged openings and ensures thorough cleaning. The solvent dispense length can be easily adjusted via software.
The new multi-function interface is user-friendly, intuitive, and offers real-time monitoring of temperature and humidity.