Specifications
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Payment Terms :
T/T, Western Union, MoneyGram
Supply Ability :
100 sets per month
Delivery Time :
7~9 work days
Packaging Details :
Wooden package
Product Name :
Mobile Phone BGA Rework Station
Warranty :
1 Year
Control :
Touch screen
PLC :
MITSUBISHI
Relay Brand :
Schneider
Optoelectronic Switch :
OMRON
Material :
Aluminum Alloy
Condition :
New
Thickness :
0.3 - 5mm
Signal :
SMEMA
Application :
Electronic Assembly
Color :
Silver
Control System :
PLC
OEM/ODM :
Available
Total power :
2600W
Power Supply :
AC220V
Air Pressure :
4-6bar
Mounting accuracy :
±0.01mm
Type :
Automatic
Weight :
30KG
Description

All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

​Specification

Mobile Phone BGA Rework Station Model:HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total power 2600W
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material Driving motor + smart temp. controller + color touch screen
Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor 1pcs
Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension L450mm*W470mm*H670mm
PCB size Max 140mm*160mm Min 5mm*5mm
BGA size Max 50mm*50mm Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 30KG
Mount chip weight 150g
Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc

Features

1. 5 work modes

2. 15''HD LCD monitor

3. 7''HD color touch screen

4. stepping motor

5. CCD color optical alignment system

6.Temperature accuracy within ±1℃

7.Mounting precision within ±0.01mm

8.Repair success rate: 99% +

9. Independent research and development of single-chip control

Advantages

1.Superior safety protection system
Heating device using a double protection mechanism, top/bottom heating wire burned out/failure of the system will automatically alarm, to eliminate the phenomenon of damage to the product due to the failure of the sensor caused by the loss of control of the text.

2.Highly Intelligent
Fully automated function can avoid personnel control errors and achieve high efficiency in the lead-free manufacturing process and the rework of pop-packed devices.

3.High sensitivity
Avoid damage to the PCB main board by the heating head during the operation of the equipment.

About Packaging

All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

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All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

Ask Latest Price
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Contact Supplier
All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station
All Brand Mobile Laptop Game Player Motherboard Repair Machine Bga Rework Station

Shenzhen Hansome Technology Co., Ltd.

Verified Supplier
7 Years
guangdong, shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
2,000,000.00-3,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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