Multilayer Circuit Board is the perfect choice for complex networking and server applications. Our 8 Layer PCB Board is designed to meet high-end requirements for signal integrity, power delivery, and emissions. Our Multilayer PCB is the perfect solution for networking and server applications. With its high-end features, the Multilayer PCB offers superior performance and reliability. Our Printed Circuit Board is designed to deliver excellent signal integrity, power delivery, and emissions. It also features a minimum line width/space of 0.05/0.05mm and a minimum PAD of 0.14mm for inner layer. Our Circuit Board Assembly is able to withstand up to four times laminations, and is offered with a variety of surface treatments, such as HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, and Electroplated Silver.
For complex networking and server applications, choose our Multilayer Circuit Board. Our 8 Layer PCB Board is the ideal choice for high-end requirements for signal integrity, power delivery, and emissions. Our Multilayer PCB is the right solution for your networking and server applications. With its advanced features, you can be assured of superior performance and reliability. Our Printed Circuit Board guarantees excellent signal integrity, power delivery, and emissions. With its minimum line width/space of 0.05/0.05mm and a minimum PAD of 0.14mm for inner layer, you can expect the highest quality performance. Our Circuit Board Assembly is able to withstand up to four times laminations, and offers a wide array of surface treatments, such as HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, and Electroplated Silver.
For the best networking and server applications, choose our Multilayer Circuit Board. Experience the reliability and performance of our 8 Layer PCB Board, Multilayer PCB, Printed Circuit Board, and Circuit Board Assembly.
Parameter | Value |
---|---|
Material | FR4 |
Layer | 2-48L |
Max. Board Size | 1000*600mm |
Max. Board Thickness | 6.0mm |
Min. Core Thickness | 0.03mm |
Min. Vias Hole Size | 0.15mm |
Min. PAD(Inner Layer) | 0.14mm |
Min. Line Width/Space | 0.05/0.05mm |
Impedance Control | ±5% |
Aspect Ratio | 20:1 |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Kingtech's Multilayer is the best choice for high-end applications. It has an outstanding impedance control of ±5%, with a misalignment of layers at 0.1mm and a back drill of 0.15mm. Furthermore, its min. line width/space is 0.05/0.05mm, and max. board thickness is 6.0mm. This top-of-the-line product is ideal for network server, FR4 multilayer PCB, 10 layer PCB assembly, and high frequency multilayer PCB.
Model Number: Multilayer
Place of Origin: China
Multi-Laminations: 4 Times
Misalignment of layers: 0.1mm
Aspect Ratio: 20:1
Min. PAD: 0.14mm For Inner Layer
Max. Board size : 1000*600mm
Kingtech 48L Multilayer Network Server Multilayer Board is designed to meet the highest standards for your needs. With its 4-layer multi-lamination and an aspect ratio of 20:1, it can support a misalignment of layers as small as 0.1 mm and a minimum PAD of 0.14 mm for the inner layer. It also has a maximum board size of 1000*600 mm.
We offer technical support and services for our Multilayer product. Our technical support team is available 24/7 to answer any questions you may have about the product. We also offer a range of services to help you get the most out of your Multilayer product, including installation assistance, troubleshooting, and training. Our team of experts is always on hand to provide advice and guidance, so please don't hesitate to contact us if you have any queries.