SMT PCB Assembly Surface Mounted Technology
The SMT manufacturing process is roughly divided into three stages, namely: solder paste printing, component placement and reflow soldering.
After welding, clean the circuit board and check for defects. If any defects are found, they are repaired and the product is stored. Common SMT inspection methods include the use of magnifying glass, AOI (Automatic Optical inspection), flight probe tester, X-ray inspection, etc. Machines are used for fast and accurate results, not the naked eye.