Technical parameters and process capability of metal substarte(MCPCB) | | | |
ITEM | SPECIFICATION | | |
Surface | LF HASL,immersion gold,immersion siliver,OSP | | |
Layer | Single side,double sided Multilayer and special structure | | |
Maximum PCB size | 240mmx1490mm OR 490x1190mm | | |
PCB thickness | 0.4-3.0mm | | |
Copper Foil thickness | H 1/2/3/4(oz) | | |
Insulation layer thickness | 50/75/100/125/150/175/200(um) | | |
Metal Base thickness | AIuminum(1100/3003/5052/6061),Copper AIuminum | | |
Metal Base thickness | 0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm) | | |
Shaping | Die punching/CNC Route/V-Cut | | |
Test | 100% open&short test | | |
Shaping tolerance | Die Punching<+- 0.05mm,CNC Route<+-0.15mm,V-CUT Thick residue>+-0.15mm | | |
Hole tolerance | +-0.5mm | | |
Min.Hole DIameter | Single side 0.5/Double sided PTH0.3MM | | |
Solder mask | green/white/black/red/yellow | | |
Min.letter height | 0.8mm | | |
Min.line space | 0.15mm | | |
Min.letter width | 0.15mm | | |
Sile screen color | blue/white/black/red/yellow | | |
Sopecial hole | Spot facing/cup hole/buried via hole/buried tank | | |
File format | Gerber,Protel,PowerPCB,AutoCAD etc | | |