P2.5 LED Display Printed Circuit Board
Practical scope: indoor and P3 full-color LED display, LED large screen practical in shopping malls, businesses, schools, stage, bank, monitoring room, conference room, hall, hotel, super, city government and enterprises, auditorium, cinema, banquet hall, hall, office, conference center, securities, public security, securities exchanges, stadium, television and other occasions.
Led display screen has a small span a wide color gamut space and faster response speed, can realize arbitrary size seamless splicing, modular maintenance. The play of the whole picture color uniform, hd is clear, no ordinary display common sweat stain, bright line and so on, according to the abnormal screen soft switching is not flashing, image quality, very sensitive, as television broadcast effect.
P1.6 small spacing LED display is need to make to order according to size, so the client when choosing LED display first to determine their actual demand, reasonable choice of LED display screen
ELED shown between small screen specifications are: P1.25, P1.56, P1.667, P1.875, P1.923, P2,
outdoor full-color LED display specification: P3, P4, P5, P6, P8, P10
indoor full color LED display specifications are: P2. P2.5, P3, P4, P5, P6
Small spacing LED display is refers to the LED pixel pitch under P2.5 indoor LED display, mainly including P2.5, P2.0, P1.923, P1.875, P1.667, P1.5625.P1.25 etc LED display products. With the improvement of the LED display manufacturing technology, the traditional LED display resolution has been improved. Running between the small LED display USES the pixel point control technology, realize to the brightness of the display screen pixel unit, color reducibility and unity of state control. On display in the production of all adopt the automatic reflow soldering process, without having to manually after welding.
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
Min. 10L | 0.55 | 0.45 | 0.4 | |
Min. 12L | 0.65 | 0.6 | 0.55 | |
MAX. | 2.4 | |||
Min. Core Thickness ( um ) | 50 | 40 | 40 | |
Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
< 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
Laser directly | +/- 50 | +/- 50 | +/- 50 | |
Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG |
Item | HLC Advanced Technology | |||
2019 | 2020 | 2021 | ||
Max Panel Width (inch) | 25 | 25 | 25 | |
Max Panel Length (inch) | 29 | 29 | 29 | |
Max Layer Count (L) | 16 | 18 | 36 | |
Max Board thickness (mm) | 3.2 | 4 | 6 | |
Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
Outer Layer ( OZ ) | 2 | 3 | 4 | |
Min DHS ( mm ) | 0.2 | 0.15 | 0.15 | |
PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
Max. AR | 12:1 | 16:1 | 20:1 | |
Item | HLC Advanced Technology | |||
2019 | 2020 | 2021 | ||
M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
<50ohms | 5 Ω | 5 Ω | 4 Ω | |
Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
Max dimple for POFV ( um ) | 30 | 20 | 15 | |
Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au |
Packaging & Delivery | |||||
Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. | ||||
Port: | Shenzhen or Hongkong | ||||
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
Est. Time(days) | 20 | 21 | 25 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China