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High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance Control
High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance Control
Specifications
Brand Name :
FASTPCB
Place of Origin :
CHINA
PCB type :
High Speed Printed Circuit Board
Base Material :
TUC/TU872LK
Number of Layers :
20 Layer
Copper Thickness :
1Oz.
Board Thickness :
5.0mm
Min. Hole Size :
0.20mm
Min. Line Width :
0.075mm
Min. Line Spacing :
0.075mm
characteristic 1 :
Impedance control
Min. blind via :
0.15mm
Description

High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance control

Anti-oxidation, high temperature resistance, waterproof

Anti-oxidation surface finish to ensure heat-shock resistance, moisture protec-tion to protect the surface from rusting and oxidation.

The 20 Layer High Speed Printed Circuit Board is a high-speed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made by pure pressing of TU872LK high-speed materials, surface gold deposition and other production processes. It is widely used in the field of high-speed computers and high-end servers in cloud data centers. The products have the characteristics of stability and durability.

Item

HDI Advanced Technology

2019

2020

2021

Structure

5+n+5

6+n+6

7+n+7

HDI Stack Via

AnyLayer(12L)

AnyLayer(14L)

AnyLayer(16L)

Board Thickness(mm)

Min. 8L

0.45

0.4

0.35

Min. 10L

0.55

0.45

0.4

Min. 12L

0.65

0.6

0.55

MAX.

2.4

Min. Core Thickness ( um )

50

40

40

Min. PP Thickness ( um )

30(#1027PP)

25(#1017PP)

20(#1010PP)

Base Copper Thickness

Inner Layer ( OZ)

1/3 ~ 2

1/3 ~ 2

1/3 ~ 2

Outer Layer ( OZ )

1/3 ~ 1

1/3 ~ 1

1/3 ~ 1

Item

HDI Advanced Technology

2019

2020

2021

Min. Mechanical Drill hole size(um) **

200

200

150

Max. Through Hole Aspect Ratio *

8:1

10:1

10:1

Min. Laser via/Pad Size ( um )

75/200

70/170

60/150

Max. Laser Via Aspect Ratio

0.8:1

0.8:1

0.8:1

Laser Via on PTH(VOP)design

Yes

Yes

Yes

Laser X type through hole(DT≤200um)

NA

60~100um

60~100um

Min. LW/S (L/S/Cu, um)

Inner Layer

45 /45 /15

40/ 40/ 15

30/ 30 /15

outer Layer

50 /50/ 20

40 /50 /20

40 /40 /17

Min BGA Pitch (mm)

0.35

0.3

0.3

Item

HDI Advanced Technology

2019

2020

2021

Solder mask Registration (um)

+/- 30

+/- 25

+/- 20

Min. Solder Mask Dam (mm)

0.07

0.06

0.05

PCB Warpage Control

>= 50ohm

+/-10%

+/-8%

+/- 5%

< 50ohm

+/- 5ohm

+/- 3ohm

+/- 3ohm

PCB Warpage Control

≤0.5%

≤0.5%

≤0.5%

cavity Depth accuracy (um)

Mechanical

+/- 75

+/- 75

+/- 50

Laser directly

+/- 50

+/- 50

+/- 50

Surface Finishing

OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag

OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG


Item

SMT Capability

2019

2020

2021

Min board thickness ( mm )

0.1

0.06

0.05

Max. board size ( mm )

200 x 250

250 x 300

250 x 350

Chip component ( L, C, R etc. )

Minimum size

1005

1005

1005

Connector

0.5 mm pitch

Y

Y

Y

0.4 mm pitch

Y

Y

Y

0.35 mm pitch

Y

Y

Y

High density component :

0.5 mm pitch

Y

Y

Y

TSOP, QFP, QFN, LGA, BGA etc.

0.4 mm pitch

Y

Y

Y

0.35 mm pitch

Y

Y

Y

Reflow

N2 reflow

No

Y

Y

Under-fill

Fill under chip

Manual

Auto

Auto

ACF attach

Gold finger pitch

N/A

0.3 mm

0.2 mm

Inspection

Component position, direction, missing etc.

Manual check with 10 x scope

Auto AOI inspection

Auto AOI inspection

Solder paste thickness

Measure once per shift

1 line auto full area, online SPI

All lines auto full area, online SPI

Packaging & Delivery

Packaging Details:

Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.

Port:

Shenzhen or Hongkong

Lead Time:

Quantity(Pieces)

1-10

11-100

101-1000

>1000

Est. Time(days)

3-5

3-5

7-9

To be negotiated




FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product tags

impedance control pcb makers

,

pcb manufacturing impedance control

,

impedance control pcb
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High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance Control

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Product Detail
Brand Name :
FASTPCB
Place of Origin :
CHINA
PCB type :
High Speed Printed Circuit Board
Base Material :
TUC/TU872LK
Number of Layers :
20 Layer
Copper Thickness :
1Oz.
Contact Supplier
High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance Control

Quanhong FASTPCB

Active Member
4 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller, Other
Main Products :
PCB Printed Circuit Board, HDI PCB Board, High Speed PCB Board
Total Annual :
12000000-15000000
Employee Number :
100~200
Certification Level :
Active Member
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