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Blue Dip Electronic Smt Pcba Motherboard For Android Industrial Control Products
Blue Dip Electronic Smt Pcba Motherboard For Android Industrial Control Products
Specifications
Brand Name :
FASTPCB
Place of Origin :
CHINA
MOQ :
10PCS
Price :
USD 0.01-100/PCS
Supply Ability :
10PCS+48Hour
Packaging Details :
Corrugated case
PCBA Type :
Industrial Control Products PCBA Manufacture
Base Material :
FR-4 TG150
Number Of Layers :
2 Layer
Copper Thickness :
1.5 Oz.
Board Thickness :
1.20mm
Min. Hole Size :
0.30mm
Min. Line Width :
0.102mm
Min. Line Spacing :
0.105mm
Surface Finishing :
HAL Lead Free
Solder Mask Color :
Blue
Description

Industrial control industry products and technology is very special. For other industries to provide reliable, embedded, intelligent industrial computers. With the deepening of social information from time to time, belongs to intermediate products. Key tasks of key industries will increasingly rely on industrial computer, and IPC based on low interest industrial control automation is becoming the mainstream, industrial computer manufacturers are paying more and more attention to the level of higher. As electric power, metallurgy, petrochemical, environmental protection, transportation, construction and other industries, the rapid development of the digital home use set-top boxes, digital TV, bank teller machines, highway toll system, gas station management, manufacturing production line control, finance, government, defense industries such as information demand increase from time to time, is a big demand for industrial control, industrial computer market development prospect is very broad, Let's take a look at what the industrial computer industry will look like in the future.

1. Develop in a comprehensive direction

Due to the development of standardized data communication lines and communication networks, all kinds of single (more) loop regulator, PLC, industrial ratio, NC and other industrial control equipment constitute a large system, in order to meet the requirements of factory automation, and adapt to the trend of openness.

2, to intelligent direction of development

Due to the development of database system, reasoning function, especially knowledge base system (KBS) and expert system (ES) application, such as self-learning control, remote diagnosis and self-excellence, artificial intelligence will be realized at all levels of DCS. Similar to FF fieldbus, microprocessor-based intelligent devices such as intelligent I/O intelligent PID control, intelligent sensors, transmitters, actuators, intelligent human interfaces and programmable regulators have emerged.

3. Simple operation direction

For industrial computer, simple operation is the best, which will become the future direction of development, simple operation can improve man-machine interface, simplify programming, operation panel using symbol keys, try to use dialogue, etc., to facilitate the use of users.

HLC Process capability

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX. 2.4
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm) 0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

SMT Capability

Item SMT Capability
2019 2020 2021
Min board thickness ( mm ) 0.1 0.06 0.05
Max. board size ( mm ) 200 x 250 250 x 300 250 x 350
Chip component ( L, C, R etc. ) Minimum size 1005 1005 1005
Connector 0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
High density component : 0.5 mm pitch Y Y Y
TSOP, QFP, QFN, LGA, BGA etc. 0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
Reflow N2 reflow No Y Y
Under-fill Fill under chip Manual Auto Auto
ACF attach Gold finger pitch N/A 0.3 mm 0.2 mm
Inspection Component position, direction, missing etc. Manual check with 10 x scope Auto AOI inspection Auto AOI inspection
Solder paste thickness Measure once per shift 1 line auto full area, online SPI All lines auto full area, online SPI

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
Est. Time(days) 3-5 3-5 7-9

To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Product tags

samsung tablet motherboard

,

android motherboard

,

motherboard for lenovo laptop
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Blue Dip Electronic Smt Pcba Motherboard For Android Industrial Control Products

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Product Detail
Brand Name :
FASTPCB
Place of Origin :
CHINA
MOQ :
10PCS
Price :
USD 0.01-100/PCS
Supply Ability :
10PCS+48Hour
Packaging Details :
Corrugated case
Contact Supplier
Blue Dip Electronic Smt Pcba Motherboard For Android Industrial Control Products

Quanhong FASTPCB

Active Member
4 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller, Other
Main Products :
PCB Printed Circuit Board, HDI PCB Board, High Speed PCB Board
Total Annual :
12000000-15000000
Employee Number :
100~200
Certification Level :
Active Member
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