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3 Oz Copper Special PCB Bonding Process
3 Oz Copper Special PCB Bonding Process
3 Oz Copper Special PCB Bonding Process
3 Oz Copper Special PCB Bonding Process
Specifications
MOQ :
10PCS
Price :
USD 0.01-100PCS
Supply Ability :
10PCS+48Hour(production time )
Packaging Details :
Corrugated case
PCB :
Bonding Process Printed Circuit Board
Base Material :
FR-4
Number Of Layers :
6 Layer
Board Thickness :
1.2mm
Min. Hole Size :
0.20mm
Min. Line Width :
0.075mm
Min. Line Spacing :
0.075mm
Solder Mask Color :
Green
Surface Treatment :
Immersion Gold
Application Area :
bonding products
Description

Bonding Process Printed Circuit Board

Bonding special process printed circuit board is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.

Technology Roadmap

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
Est. Time(days) 20 21 25 To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

3 Oz Copper Special PCB Bonding Process

Product tags

metal bonding filler

,

copper base brazing paste

,

nickel plating pcb
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3 Oz Copper Special PCB Bonding Process

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Product Detail
MOQ :
10PCS
Price :
USD 0.01-100PCS
Supply Ability :
10PCS+48Hour(production time )
Packaging Details :
Corrugated case
PCB :
Bonding Process Printed Circuit Board
Base Material :
FR-4
Contact Supplier
3 Oz Copper Special PCB Bonding Process
3 Oz Copper Special PCB Bonding Process

Quanhong FASTPCB

Active Member
4 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller, Other
Main Products :
PCB Printed Circuit Board, HDI PCB Board, High Speed PCB Board
Total Annual :
12000000-15000000
Employee Number :
100~200
Certification Level :
Active Member
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