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12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
Specifications
Brand Name :
FASTPCB
MOQ :
10PCS
Price :
USD 0.01-100PCS
Payment Terms :
L/C, T/T
Supply Ability :
25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Packaging Details :
Inner: vacuum packing or Anti-static package, Outer: export carton
PCB :
Mobile Phone 3rd Order HDI PCB
Base Material :
SY S1000-2M
Number of Layers :
12Layer
Board Thickness :
1.2mm+/-10%
Min. Line Width :
0.065mm（2.5mil）
Surface Finishing :
Immersion Gold+OSP
Minimum plate thickness aperture ratio :
8:1
Min. Hole Size :
Laser hole: 0.1mm
Description

Mobile Phone 3rd Order HDI PCB

The third-order HDI board of mobile phone is one of the series of third-order HDI PCB boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of Shengyi s1000-2m material through surface gold deposition, laser drilling and OSP. The minimum line width and line spacing are 65 / 65um and 0.1mm respectively. The HDI circuit board is widely used in the field of smart phones.

Rigid PCB Manufacturing Capability

Rigid PCB Manufacturing Capability
Item PCB HDI
Layer 1-40 1-40
Minimum linewidth/linespacing 3MIL/3MIL(0.075mm) 2MIL/2MIL(0.05MM)
Minimum hole diameter 6MIL(0.15MM) 6MIL(0.15MM)
Minimum solder resist opening (single-side) 1.5MIL(0.0375MM) 1.2MIL(0.03MM)
Minimum solder resist bridge 3MIL(0.075MM) 2.2MIL(0.055MM)
Maximum aspect Ratio (thickness/hole diameter) 10:01 8:01
Impedance control accuracy +/-8% +/-8%
Finished thickness 0.3-3.2MM 0.2-3.2MM
Maximum board size 630MM*620MM 620MM*544MM
Maximum finished copper thickness 6OZ(210UM) 2OZ(70UM)
Minimum board thickness 6MIL(0.15MM) 3MIL(0.076MM)
Maximum layer 14层 12层
Surface treatment HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag Immersion Gold,OSP,selectiveimmersion gold,
carbon print
Min/max laser hole size / 3MIL / 9.8MIL
Laser hole size tolerance / 10%

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
Est. Time(days) 20 21 25 To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm

Product tags

1.6mm thick 4 layer pcb

,

4 layer 1.6mm thick pcb

,

6-layer pcb
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12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm

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Product Detail
Brand Name :
FASTPCB
MOQ :
10PCS
Price :
USD 0.01-100PCS
Payment Terms :
L/C, T/T
Supply Ability :
25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Packaging Details :
Inner: vacuum packing or Anti-static package, Outer: export carton
Contact Supplier
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm
12 Layer Mobile Phone Pcb Board High Density Interconnect Technology Thickness 1.6mm

Quanhong FASTPCB

Active Member
4 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller, Other
Main Products :
PCB Printed Circuit Board, HDI PCB Board, High Speed PCB Board
Total Annual :
12000000-15000000
Employee Number :
100~200
Certification Level :
Active Member
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