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2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
Specifications
Brand Name :
Huashengxin
Model Number :
4 Layer 1+N+1 HDI printed circuit board
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Delivery Time :
fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details :
vacuum
PCB Name :
quick pcb prototype
Marterial :
FR4, AntiCaf
Board Layer :
4L
Board Thickness :
1.6mm
Finished Copper Weight Outer :
2.0oz
Internal Copper Weight Inner :
2.0oz/70um
IPC Class Required :
Class 3
Smallest Hole Size :
0.2mm
Blind Vias :
Yes
Application :
Wifi production
Description

2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au

HDI PCB Board PCB Hdi Black PCB Board PCB Board Assembly Low Volume PCB Low Volume PCB Manufacture Quick PCB Prototype​

4 Layer 1+N+1 HDI printed circuit board

PCB Layer HDI printed circuit board(4L)
PCB surface Immersion Au 2u”
PCB material FR-4, AntiCaf
PCB thickness 1.6mm
Min. hole size 0.20mm
PCB solder mask Black, both side
PCB silkscreen White, both sides
Finished Copper Weight Outer 2.0oz
Internal Copper Weight Inner 2.0oz/70um
IPC Class Required Class 3
Application Wifi production

High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring. They have a faster connection while reducing the size of a project. Normally, these boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. A HDI board can house the functionality of the previous boards used.

HDI Board Stack-up:

1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au

2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au

FAQ:

1. What service can you provide?

PCB Manufacture,PCB Assembly,Rapid Prototype

2. How fast is your lead time?

Fastest 24H for 2L and 4L, 3WDs for HDI board.

3. How to get quick quotation?

Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)

sample:

PCB Layer 2L
PCB surface LF-HASL
PCB material FR4, TG170
Copper thickness 1/1oz finished
PCB solder mask Double side,green
PCB silkscreen Double side,White
Quantity 15pcs,15 working day

4.What payment terms do you have?

Wire Transfer(T/T)

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2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au

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Product Detail
Brand Name :
Huashengxin
Model Number :
4 Layer 1+N+1 HDI printed circuit board
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Contact Supplier
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au
2oz 1.6mm Hdi Black PCB Board FR4 Quick PCB Prototype Immersion Au

Huashengxin Circuit Limited

Verified Supplier
4 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Main Products :
Quick Turn PCB Boards, HDI PCB Board, Single Sided PCB
Total Annual :
50000000-65000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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