Specifications
Brand Name :
Huashengxin
Model Number :
135464
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Delivery Time :
fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details :
vacuum
PCB Name :
4L 1+N+1 High-Density Interconnector PCB
Marterial :
FR4 TG170
Surface finished :
Immersion gold
Board Thickness :
2.0mm
Copper thickness :
1/1/1/1OZ
Min.PCB track/gap: :
4/4mil
Solder mask :
Green, two sides
Smallest Mechanical drilling hole: :
0.2mm
Special requirement :
impedance control/high TG
Applicationcommunications products :
Communications products
Description

4mil High Density Interconnect PCB Board Fabrication FR4 TG170

HDI PCB Board PCB Prototype Board PCB Prototype Board HDI Board PCB Manufacturing Service FR4 PCB Board

4L 1+N+1 High-Density Interconnector Printed Circuit Boards


HDI stands for High-Density Interconnector. It is a special type of PCB that has the capability of high-density interconnections. It means that HDI boards has more wires or conduction lines per unit area, utilizing the most out of the space and offering a compact PCB.

HDI PCB has tightly packed interconnections, it saves a lot of space and offers more component density and it has the capability of making a circuit compact.

HDI boards are particularly attractive to portable, mobile, and portable electronics due to their slim, dependable performance and tiny size. HDI technology is a critical component of many of advanced technologies. The miniaturization of electronic components including PCBs has enabled manufacturers to produce smaller, more cost-effective devices without sacrificing performance or reliability.

They are largely used in Consumer Electronics, communication, Automotive and Aerospace,Medical Devices, and industry control products and other industries.

Circuit board Layer count: 4L Circuit board laminate: FR4 TG170
Layer Copper thick: 1/1/1/1OZ Board thickness: 2.0MM
Smallest hole size: 0.20mm Smallest PCB track/gap: 4/4mil
Solder mask color: TAIYO Green Silk screen color: White
PCB surface finished: Immersion Gold Board profile: Routing
PCB Board Application: communications
Requesting Special requirement: HDI Buried vias and blind vias, one step stack up /impedance control/high TG

4mil High Density Interconnect PCB Board Fabrication FR4 TG1704mil High Density Interconnect PCB Board Fabrication FR4 TG170

FAQ:
Q1:Could you provide PCB Assembly services and components sourcing?
A: Yes, we could also provide components sourcing and PCB Assembly services as well as box build if request.

Q2:Which countries have you worked with?
A:USA, Canada, Italy, Germany, UK, Spain, France, Russia, Iran, Turkey, Czech Republic,Austria, Australia, Brazil, Japan, India etc.

Q3:Will our PCB files be checked.
A: Yes. Your data will be checked by our Engineers Team. If we find any technical issues or have any inquires, we will contact you and solve the problems together.

Q4: Does our product will be tested before shipment.
A: Yes. We could provide Function Circuit Testing if you provide us the testing methods.

Q5:Which payment method do you accept?
A: Wire Transfer(T/T), Letter of Credit(L/C), or Paypal( Paypal is only for small value less than 500usd)

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4mil High Density Interconnect PCB Board Fabrication FR4 TG170

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Brand Name :
Huashengxin
Model Number :
135464
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Contact Supplier
4mil High Density Interconnect PCB Board Fabrication FR4 TG170
4mil High Density Interconnect PCB Board Fabrication FR4 TG170

Huashengxin Circuit Limited

Verified Supplier
4 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Total Annual :
50000000-65000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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