Specifications
Brand Name :
Huashengxin
Model Number :
ED9A8093
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Delivery Time :
fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details :
vacuum
PCB Layer :
Double Layer Flexible PCB
Material :
PI
Board Layer :
2L
Finished treatment :
ENIG
Copper thickness :
1/1oz
Minimum drilling size :
0.1mm
Description

PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight

Flex PCB Board Flex Printed Circuit Board Flexible Printed Circuit Board Flexible Circuits Flex Circuits

Double Layer Flexible PCB

Flexible circuits (also called as flex circuits, flexible printed circuit boards, flex PCB, etc) are consisted of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since long long time ago. It is now one of the most important interconnection technologies in use for the manufacture of many advanced electronic products.

In practice there are many different kinds of flexible circuits, including one metal layer, double sided, multilayer and rigid flex circuits. The circuits can be formed by etching metal foil cladding (normally of copper) from polymer bases, plating metal or printing of conductive inks among other processes.

Advantage:
1) Accuracy of designs. Most of the advanced electronic devices in use today use flexible circuit boards because of the high level of precision expected of them.


2) They are lightweight. The circuit boards can be folded easily, thus they can be positioned in compartments.


3) Long-term performance. The superior qualities of flexible circuit boards allow them to have durability and long-term performance. The characteristics of low ductility and mass contained in these boards allow them to overcome the influence of vibrations, therefore giving them the capacity to have improved performance.


4) Heat dissipation. Because of the compact designs of the circuit board, there are shorter thermal paths generated and the dissipation of heat is faster compared to other kind of PCBs.


5) Flexibility. Due to their ability to be flexible, it is easily to bend flexible circuit boards to various levels when installing them, thus make it possible to enhance the functionality levels of various electronics.

FPC Technology Capability
Attribute (All dimensions are mils unless
otherwise specified)
Mass Production (Yield
80%,Cpk1.33)
Small Amount(Yield60%, Key
Specification Yield80%
Sample
FPC(yes/no) yes yes yes
Layer count/Structure, Max. 2 4 6
Size(L×W), Max. 550mm*250mm 550mm*250mm 700mm*250mm
Nominal thickness (mm) 0.1~0.5 0.1~0.5 0.1~0.8
Thickness tolerance ±10%(>0.3mm)/±0.03mm(0.3mm) ±10%(>0.3mm)/±0.03mm(0.3mm) ±10%(>0.3mm)/±0.03mm(0.3mm)
Surface finish type ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold
Soft ENIG(yes/no) no no no
Base material type PI PI PILCPTK
Coverlay thickness (um) 28/50/60/80 28/50/60/80 28/50/60/80
Adhesive thickness (um) 25/40/50/65 25/40/50/65 25/40/50/65
Copper thickness, Min./Max. (um) 12-70 12-70 12-70
Base material thickness, Min./Max. (um) 25-75 25-75 25-100
Mechanical drilled thru-hole size (DHS), Min. 0.15 0.15 0.15
Plating aspect ratio, Max. 3:1 3:1 5:1
Pad size, Min. With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.3mm
Without through hole:0.2mm
Pad size tolerance 20% 20% 10%
Pad to pad space, Min. 4mil 4mil 4mil
Pad to outline tolerance ±3mil ±3mil ±2mil
Pattern location accurancy ±3mil ±3mil ±2mil
Pattern location accurancy from top side to bottom ±3mil ±3mil ±2mil
Laser via hole diameter/pad, Min. 4/12mil 4/10mil 4/10mil
Outerlayer(Hoz+plating) line width/space, Min. 3/3mil 3/3mil 2/2mil
Innerlayer(Hoz) line width/space, Min. 3/3mil 3/3mil 2/2mil
Inner line width tolerance ±10% ±10% ±10%
Outerlayer registration, Min. (Pad diameter = DHS + X) DHS + 8 DHS + 8 DHS + 6
Innerlayer registration, Min. (Pad diameter = DHS + X)(L4 layer) DHS + 10 DHS + 10 DHS + 8
Laser via hole pitch, Min. 0.40mm 0.40mm 0.35mm
Mechanical hole pitch, Min. 0.50mm 0.50mm 0.40mm
Drilled hole position tolerance ±2mil ±2mil ±2mil
Hole size tolerance ±2mil ±2mil ±2mil
Location accurancy from tooling hole(PTH&NPTH) to pad ±3mil ±3mil ±2mil
Location accurancy from tooling hole(PTH&NPTH) to outline ±3mil ±3mil ±2mil
Outline size tolerance ±2mil ±2mil ±2mil
LPI registration/dam, Min. 2mil/4mil 2mil/4mil 2mil/3mil
LPI dam on CVL 8mil 8mil 8mil
Coverlay open window/dam Φ0.5mm/0.3mm Φ0.5mm/0.3mm Φ0.3mm/0.2mm
Coverlay registration/Resin flow 4mil 4mil 2mil
Stifferness material FR4/PI/Steel FR4/PI/Steel FR4/PI/Steel
Stifferness dam, Min. 12mil 12mil 8mil
Stifferness registration/Resin flow 8mil/4mil 8mil/4mil 4mil/2mil
Impedance tolerance 10% 10% 5%
Thermal reliability(LPI, FCCL, CVL) 288°/10s/3times 288°/10s/3times 288°/10s/3times
Qualified material and structure UL PI PI PI

PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight+

FAQ:

Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.

Q2:What kind of PCB file format can you accept for production?
A: Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350, ODB+(.TGZ)

Q3:Are my PCB files safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from your side, nor we'll share these files with any other 3rd parties. And we could sign NDA with client if necessary.

Q4:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q5:What is your standard lead time for PCB?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days

Q6:What payment do you accept ?
A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)

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PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight

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Brand Name :
Huashengxin
Model Number :
ED9A8093
Certification :
UL , ISO9001
Place of Origin :
China
MOQ :
1pcs
Payment Terms :
T/T
Contact Supplier
PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight
PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight

Huashengxin Circuit Limited

Verified Supplier
4 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Total Annual :
50000000-65000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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