1oz Quick Turn Flex PCB Board
Flex PCB Board PCBA Printed Circuit Board Assembly Quick Turn PCBA PCBA Manufacturing PCBA Manufacturing
Double Layer Flexible PCB
Flexible circuits (also called as flex circuits, flexible printed circuit boards, flex PCB, etc) are consisted of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since long long time ago. It is now one of the most important interconnection technologies in use for the manufacture of many advanced electronic products.
In practice there are many different kinds of flexible circuits, including one metal layer, double sided, multilayer and rigid flex circuits. The circuits can be formed by etching metal foil cladding (normally of copper) from polymer bases, plating metal or printing of conductive inks among other processes.
Advantage:
1)Accuracy of designs. Most of the advanced electronic devices in use today use flexible circuit boards because of the high level of precision expected of them.
2)They are lightweight. The circuit boards can be folded easily, thus they can be positioned in compartments.
3)Long-term performance. The superior qualities of flexible circuit boards allow them to have durability and long-term performance. The characteristics of low ductility and mass contained in these boards allow them to overcome the influence of vibrations, therefore giving them the capacity to have improved performance.
4)Heat dissipation. Because of the compact designs of the circuit board, there are shorter thermal paths generated and the dissipation of heat is faster compared to other kind of PCBs.
5)Flexibility. Due to their ability to be flexible, it is easily to bend flexible circuit boards to various levels when installing them, thus make it possible to enhance the functionality levels of various electronics.
FPC Technology Capability | |||
Attribute (All dimensions are mils unless otherwise specified) | Mass Production (Yield≥ 80%,Cpk≥1.33) | Small Amount(Yield≥60%, Key Specification Yield≥80% | Sample |
FPC(yes/no) | yes | yes | yes |
Layer count/Structure, Max. | 2 | 4 | 6 |
Size(L×W), Max. | 550mm*250mm | 550mm*250mm | 700mm*250mm |
Nominal thickness (mm) | 0.1~0.5 | 0.1~0.5 | 0.1~0.8 |
Thickness tolerance | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) |
Surface finish type | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold |
Soft ENIG(yes/no) | no | no | no |
Base material type | PI | PI | PILCPTK |
Coverlay thickness (um) | 28/50/60/80 | 28/50/60/80 | 28/50/60/80 |
Adhesive thickness (um) | 25/40/50/65 | 25/40/50/65 | 25/40/50/65 |
Copper thickness, Min./Max. (um) | 12-70 | 12-70 | 12-70 |
Base material thickness, Min./Max. (um) | 25-75 | 25-75 | 25-100 |
Mechanical drilled thru-hole size (DHS), Min. | 0.15 | 0.15 | 0.15 |
Plating aspect ratio, Max. | 3:1 | 3:1 | 5:1 |
Pad size, Min. | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.3mm Without through hole:0.2mm |
Pad size tolerance | 20% | 20% | 10% |
Pad to pad space, Min. | 4mil | 4mil | 4mil |
Pad to outline tolerance | ±3mil | ±3mil | ±2mil |
Pattern location accurancy | ±3mil | ±3mil | ±2mil |
Pattern location accurancy from top side to bottom | ±3mil | ±3mil | ±2mil |
Laser via hole diameter/pad, Min. | 4/12mil | 4/10mil | 4/10mil |
Outerlayer(Hoz+plating) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Innerlayer(Hoz) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Inner line width tolerance | ±10% | ±10% | ±10% |
Outerlayer registration, Min. (Pad diameter = DHS + X) | DHS + 8 | DHS + 8 | DHS + 6 |
Innerlayer registration, Min. (Pad diameter = DHS + X)(L≤4 layer) | DHS + 10 | DHS + 10 | DHS + 8 |
Laser via hole pitch, Min. | 0.40mm | 0.40mm | 0.35mm |
Mechanical hole pitch, Min. | 0.50mm | 0.50mm | 0.40mm |
Drilled hole position tolerance | ±2mil | ±2mil | ±2mil |
Hole size tolerance | ±2mil | ±2mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to pad | ±3mil | ±3mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to outline | ±3mil | ±3mil | ±2mil |
Outline size tolerance | ±2mil | ±2mil | ±2mil |
LPI registration/dam, Min. | 2mil/4mil | 2mil/4mil | 2mil/3mil |
LPI dam on CVL | 8mil | 8mil | 8mil |
Coverlay open window/dam | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | Φ0.3mm/0.2mm |
Coverlay registration/Resin flow | 4mil | 4mil | 2mil |
Stifferness material | FR4/PI/Steel | FR4/PI/Steel | FR4/PI/Steel |
Stifferness dam, Min. | 12mil | 12mil | 8mil |
Stifferness registration/Resin flow | 8mil/4mil | 8mil/4mil | 4mil/2mil |
Impedance tolerance | 10% | 10% | 5% |
Thermal reliability(LPI, FCCL, CVL) | 288°/10s/3times | 288°/10s/3times | 288°/10s/3times |
Qualified material and structure UL | PI | PI | PI |
FAQ:
Q1: How can I get a quotation?
A: Please send us gerber file with format Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350, ODB and provide the demand quantities. We will provide quotation accordingly.
Q2: Can you manufacture the PCBs from a picture file?
A: No. But if you can send us a sample PCB, we could clone its design and work it out.
Q3: Do you have PCB in stock.
A: Most of the PCB boards are customized, and they have different designs, we produce them according to the gerber files provided by customers.
Q4: What FR4 materials do you usually use?
A: Kingboard, ITEQ, Shengyi...
Q5:What kind of shipment way do you usually use?
A: For small volume order, we always suggest to ship the boards by DHL,UPS,FedEx door to door service, we could use your shipping account to do collection or use our account to ship in DDU (import duty unpaid) delivery term.
And for big volume order, to save freight cost, we will suggest to arrange the shipment by air or by sea, Of course, if you have your own forwarder and can provide us the information, we can contact them to arrange the shipment.