High Precision Laser Depaneling Machine PCB Separator for 600*450mm PCB Boards
1. Principle of PCB laser cutting machine
2. Technical Parameters
Parameter | ||
Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
Weight of the | 1500Kg | |
Power | AC220 V | |
Laser | 355 nm | |
Laser |
Optowave 10W(US) | |
Material | ≤1.2 mm | |
Precisio | ±20 μm | |
Platfor | ±2 μm | |
Platform | ±2 μm | |
Working area | 600*450 mm | |
Maximum | 3 KW | |
Vibrating | CTI(US) | |
Power | AC220 V | |
Diameter | 20±5 μm | |
Ambient | 20±2 ℃ | |
Ambient | <60 % | |
The Machine | Marble |
3. Advantages
High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
Email/Skype: s5@smtfly.com
Mobile/Wechat/WhatsApp: +86-136-8490-4990