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1.6mm Multi-Layers Hdi Pcb Board 53.7＊56mm Size

Specifications

Brand Name :

HNL-PCBA

Model Number :

PCB Assembly 012

Certification :

ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000

Place of Origin :

CHINA

MOQ :

3 PC

Price :

Negotiable

Payment Terms :

T/T, Western Union, L/C, MoneyGram

Supply Ability :

10,000,000 Point /Day

Delivery Time :

1-7days

Packaging Details :

ESD packaging with carton box

Product name :

ENIG multi-layer 1oz HDI PCB

Material :

HF FR4

Copper thickness :

1oz

Min. line Width/spacing :

0.1mm＊0.1mm

Min. hole size :

0.12mm

Usage :

OEM Electronics Circuit Board Assembly communication use

Board thickness :

1.6mm

solder mask :

Green or Black. Red. Yellow. White. Blue etc.

Type :

buried vias and through vias

Surface Finishing :

ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD

Description

ENIG 2.0mm Multi-layers 1oz HDI PCB Printed Circuit Board

Name: 16mm MultiLayers Hdi Pcb Board 53756mm Size
Brand: HNL-PCBA
Price: 1 USD

HDI PCB Board Introduction

High Density Interconnection,shorted as (HDI) PCB, is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. To meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.

PCB CAPABILITIES

FACTORY CAPABILITIES
No.	Items	2020
1	HDI Capabilities	HDI ELIC(5+2+5)
2	Max layer count	46L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4	Min.Hole Size	Laser 0.05mm
		Mechnical 0.15mm
5	Min Line Width/Space	0.030mm/0.030mm
6	Copper Thickness	1/3oz-6oz
7	Size Max Panel size	700x610mm
8	Registration Accuracy	+/-0.05mm
9	Routing Accuracy	+/-0.05mm
10	Min.BGA PAD	0.125mm
11	Max Aspect Ratio	10:01
12	Bow and Twist	0.50%
13	Impedance Control Tolerance	+/-5%
14	Daily output	4,000m2 (Max capacity of equipment)
15	Surface Finishing	HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

The types of HDI PCB

1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.