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Low Dk Multilayer HDI Lead Free PCB Assembly

Specifications

Brand Name :

HNL-PCBA

Model Number :

Lead Free PCB Assembly

Certification :

ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000

Place of Origin :

CHINA

MOQ :

1 PC

Price :

Negotiable

Payment Terms :

T/T, Western Union, L/C, MoneyGram

Supply Ability :

10,000,000 Point /Day

Delivery Time :

1-7days

Packaging Details :

ESD packaging with carton box

Product name :

Lead Free PCB Assembly

Layers :

Double side ,Multilayer

Copper thickness :

0.3oz-6oz

Min. line spacing :

0.030mm/0.030mm

Min. hole size :

Laser 0.05mm ; Mechnical 0.15

Board thickness :

0.3mm 1.2mm 1.6mm 2.0mm ...... 3.5mm

Solder mask color :

Green, Yellow, Red, Black, Blue, Whiteetc

Material :

FR-4/Normal Tg/High Tg/Low Dk/HF FR4/ aluminium

Surface finishing :

HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

Application :

communication industry : Aerospace ; Telecom Communication ;Military & ; Automotive Industry ;Industrial Control ;Consumer Electronics .etc.

Description

Low Dk Multilayer HDI Lead Free PCB Assembly

Name: Low Dk Multilayer HDI Lead Free PCB Assembly
Brand: HNL-PCBA
Price: 1 USD

Lead Free PCB Assembly Introduction

We have a comprehensive lead-free solder solution. including solder alloy selection, solder paste evaluation, wave solder flux evaluation, process optimization, design rules, components evaluation, reliability, equipment evaluation, quality inspection and production costs. We have worked actively with industry standard organizations to facilitate the industry-wide transition to lead-free products.
Our Lead-Free services include:
Lead Free Printed Circuit Boards
Lead Free Rework
Lead free Assembly (SMT or THA)
Lead Free Wave Soldering
Lead-Free Materials Analysis

Factory Capabilities

FACTORY CAPABILITIES
No.	Items	2019	2020
1	HDI Capabilities	HDI ELIC (4+2+4)	HDI ELIC(5+2+5)
2	Max layer count	32L	36L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4	Min.Hole Size	Laser 0.075mm Mechnical 0.15	Laser 0.05mm Mechnical 0.15
5	Min Line Width/Space	0.035mm/0.035	0.030mm/0.030mm
6	Copper Thickness	1/3oz-4oz	1/3oz-6oz
7	Size Max Panel size	700x610mm	700x610mm
8	Registration Accuracy	+/-0.05mm	+/-0.05mm
9	Routing Accuracy	+/-0.075mm	+/-0.05mm
10	Min.BGA PAD	0.15mm	0.125mm
11	Max Aspect Ratio	10:1	10:1
12	Bow and Twist	0.50%	0.50%
13	Impedance Control Tolerance	+/-8%	+/-5%
14	Daily output	3,000m2 (Max capacity of equipment)	4,000m2 (Max capacity of equipment)
15	Surface Finishing	HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA CAPABILITIES

PCBA Capability
Material Type	Item	Min	Max
PCB	Dimension (length,width,height.mm)	50400.38	6004004.2
	Material	FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
	Surface finish	HASL,OSP,Immersion gold,Flash Gold Finger
Components	Chip&IC	1005	55mm
	BGA Pitch	0.3mm	-
	QFP Pitch	0.3mm	-

PCB Aassembly Production Process

PCB,Component sourcing ,QC ,SMT Process ,AOI ,Test ,Automatic optical inspection ,DIP Process ,Washing board ,FQC .