Specifications
Brand Name :
HNL-PCBA
Model Number :
PCB Assembly03
Certification :
ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
Place of Origin :
CHINA
MOQ :
1 PC
Price :
Negotiable
Payment Terms :
T/T, Western Union, L/C, MoneyGram
Supply Ability :
10,000,000 Point /Day
Delivery Time :
1-7days
Packaging Details :
ESD packaging with carton box
Product name :
PCB Assembly Prototype
Base Material :
FR4 CEM1 CEM3 Ceramic
Copper thickness :
0.33oz to 6oz
Max Board size :
700x610mm; custom size
Min. line width :
0.030mm
Board thickness :
0.3-3.5mm
Surface finishing :
HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
Item :
Custom Circuit Board,OEM/ODM
Min. hole size :
0.20mm,0.1mm,8 mil/6 mil,0.065,0.15-0.2mm
Solder mask color :
green/black/white/red/blue
Description

OEM FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

PCB Assembly Prototype Introduction

For no proper printed circuit boards without designing, PCB Prototype is the basic way for making the circuit boards.

Our experience to build PCB prototypes is just 24 hours.

The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations.

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs.

PCB CAPABILITIES

FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA CAPABILITIES

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

Our SMT capabilities:

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

Our DIP function:

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

Hot Tags: customize pcba for medical breathing machine, China, supplier, manufacturer, factory, OEM manufacturer, vendor, samples, production, prototypes, quick turn

PCB Assembly Prototype Process

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

PCB Assembly Prototype Delivery Time

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

PCB Assembly Prototype Application Field

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

Workshop

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

PCB Assembly Prototype Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

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FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

Ask Latest Price
Brand Name :
HNL-PCBA
Model Number :
PCB Assembly03
Certification :
ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
Place of Origin :
CHINA
MOQ :
1 PC
Price :
Negotiable
Contact Supplier
FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype
FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

Beijing Haina Lean Technology Co., Ltd

Active Member
4 Years
beijing, beijing
Since 2006
Business Type :
Manufacturer, Exporter, Seller
Total Annual :
600-1000
Employee Number :
200~300
Certification Level :
Active Member
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