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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
Specifications
Brand Name :
ASM
Model Number :
NOVA Plus
Place of Origin :
China
MOQ :
1 unit
Packaging Details :
Wooden Box
Application :
Die Bonder and Flip Chip Bonder
Model :
NOVA Plus
Brand :
ASM
Features :
Modular machine concept for all micro assembly applications
Condition :
Original and Pre-owned
Functionality :
for industrial use
Packaging :
Wooden Crate
Lead Time :
15 working days
Payment Terms :
20% deposit - 80% before delivery
Price :
Negotiable
Description

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder

ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features.

Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NOVA Plus Die Bonder and Flip Chip Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.

ASM NOVA Plus Die Bonder and Flip Chip Bonder

Dimensions

W x D x H

1240 x 2140 x 1980 mm

Features:

  • high precision die bonder / flip chip bonder
  • accuracy +/- 2.5 µm @ 3s
  • a cycle- time of < 3 sec*
  • modular machine concept for all micro-assembly applications
  • eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • multi flip-chip bonding
  • wafer mapping
  • post bond inspection/ measurement
  • substrate working area of 550 x 600 mm
  • active bond-force-control

Autoloading for up to:

  • 12" wafers
  • 300 mm wafers
  • 450 mm substrate wafers

Optional:

  • UV- Curing
  • Dispensing

... and more!

The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:

  • Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
  • MEMS
  • Automotive Sensors
  • RFID
  • LED
  • Optoelectronic

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

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Product Detail
Brand Name :
ASM
Model Number :
NOVA Plus
Place of Origin :
China
MOQ :
1 unit
Packaging Details :
Wooden Box
Application :
Die Bonder and Flip Chip Bonder
Contact Supplier
ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

INFINITE AUTOMATION CO ., LIMITED

Verified Supplier
5 Years
shenzhen
Since 2006
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
PCB SMT Machine, SMT Printer Machine, SMT Feeders
Employee Number :
50~100
Certification Level :
Verified Supplier
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