Specifications
Brand Name :
Betterliv/OEM
Model Number :
OEM
Certification :
ISO9001 FCC
Place of Origin :
Shenzhen,China
Payment Terms :
T/T, Western Union, Credit Card
Layer :
6
Min. Line Width :
8mil
Base Material :
FR4 TG130
Copper Thickness :
1OZ
Surface finish :
ENIG
Board thickness :
1.6mm
Description

Fast Custom 6 Layers HDI Buried Blind Vias Hole PCB Quick Turn PCB Assembly For Eelectrical Products

PCB Manufacture Capability

Layers
6 Layers
Material
FR4 TG130
Copper thichness
1oz
Board thickness
1.6mm
Min. Hole Size
0.3mm
Min. Line Width
8mil
Min. Line Spacing
8mil
Surface Finish
ENIG
S/M Color
Blue
Special Process
HDI, BVH, back drill, pressfit hole, edge plating, VOP, counter sunk, half hole, gold plating, gold finger, ENIG+OSP, flex board, rigid-flex board

Our service

We are manufacturer, specializing in PCB and PCBA R&D and production.

Our products are widely applied to a variety of electronic industries such as communications,industrial control,medical electronics and automotive electronics.

• Electronic components material purchasing
• Bare PCB fabrication
• PCB Assembly Service. (SMT, DIP)
• FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test (FCT)
• Conformal coating service
• Prototyping and mass production...
• PCB layout, PCBA design according to your idea

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TG130 6 Layer PCB Board ENIG Surface finish HDI Buried Blind Vias Hole

Ask Latest Price
Brand Name :
Betterliv/OEM
Model Number :
OEM
Certification :
ISO9001 FCC
Place of Origin :
Shenzhen,China
Payment Terms :
T/T, Western Union, Credit Card
Layer :
6
Contact Supplier
TG130 6 Layer PCB Board ENIG Surface finish HDI Buried Blind Vias Hole

Shenzhen Betterliv Technology Co., Ltd.

Active Member
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Importer, Exporter
Employee Number :
100~200
Certification Level :
Active Member
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