Headphone Lower Housing (1*2)
No.23306 &23307
Mold base P/N: DAI2740 808090 | |||
Mold size | Length | Slide | |
270 | 4 | ||
Width | Lifter | ||
490 | 10 | ||
Height | Double-shot molding | ||
406 |
Mold weight | IMM Tonnage | Type | Standard | ||||
900kg | 180T | Three-plates mold | LKM |
Gate | Tool life | Surface finish | Steel of cavity & core | ||||
Pin point gate | 500K shots | A surface polished to SPI-B1 | Harden (1*2/S136) |
Part material | Part weight | Part size | Injection/runner type | ||||
PC/PC+ABS | 1.6g | 55.01*21.4*11.5mm | Hot runner |
Display diagram