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Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ
Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ
Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ
Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ
Specifications
Brand Name :
HUASWIN
Model Number :
HSPCBA1018
Certification :
ISO/UL/RoHS
Place of Origin :
China
MOQ :
1 sets
Price :
Negotiation
Payment Terms :
T/T, Western Union, L/C
Supply Ability :
10,000pcs per month
Delivery Time :
15-20 working days
Packaging Details :
Anti-static bag + Anti-static bubble wrap + Good quality carton box
Material :
Taconic
Surface Finishing :
Lead free HASL
Screencolor :
White
Copper Thickness :
1 OZ
Sold Mask :
Green
layer :
6
Description

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ Surface Finishing Green Sold Mask OEM ODM

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

FAQ


Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position

Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.


Detailed Specification of PCB Manufacturing

1 layer 1-30 layer
2 Material CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,
Aluminum-based material.
3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,
OSP
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling



Detailed Specification of Pcb Assembly

1 Type of Assembly SMT and Thru-hole
2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
3 Components Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
3 Bare Board Size Smallest:0.25x0.25 Inches
Largest:20x20 Inches
4 File Formats Bill of Materials
Gerber Files
Pick-N-Place File(XYRS)
5 Type of Service Turn-Key,Partial Turn-Key or Consignment
6 Component Packaging Cut Tape
Tube
Reels
Loose Parts
7 Turn Time 15 to 20 days
8 Testing AOI inspection
X-Ray inspection
In-Circuit testing
Functional test


PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test


Chip On Board Assembly Quality Processes:


1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949


Testing:


AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming

Product tags

taconic pcb material details

,

taconic pcb material

,

pcb material taconic
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Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

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Product Detail
Brand Name :
HUASWIN
Model Number :
HSPCBA1018
Certification :
ISO/UL/RoHS
Place of Origin :
China
MOQ :
1 sets
Price :
Negotiation
Contact Supplier
Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ
Chip On Board Assembly PCB Taconic Material Multilayer Copper Thickness 1OZ

Huaswin Electronics Co.,Limited

Active Member
11 Years
Since 2000
Business Type :
Manufacturer, Exporter
Main Products :
PCB Board Assembly, Turnkey PCB Assembly, PCB Assembly Services
Employee Number :
>500
Certification Level :
Active Member
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